PD - 96355
AUTOMOTIVE GRADE
AUIRFR024N
AUIRFU024N
HEXFET® Power MOSFET
Features
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AdvancedPlanarTechnology
LowOn-Resistance
D
S
Dynamic dV/dT Rating
175°COperatingTemperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to Tjmax
V(BR)DSS
55V
RDS(on) max.
ID
0.075
17A
Ω
G
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Lead-Free,RoHSCompliant
Automotive Qualified *
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Description
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Specifically designed for Automotive applications, this
Cellular design of HEXFET® Power MOSFETs utilizes
the latest processing techniques to achieve low on-
resistancepersiliconarea.Thisbenefitcombinedwiththe
fast switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in Automotive and a wide variety of other
applications.
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D
G
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I-Pak
D-Pak
AUIRFR024N
AUIRFU024N
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated
in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still
air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
17
Units
I
I
I
@ T = 25°C
C
D
D
12
A
@ T = 100°C
C
68
DM
45
Power Dissipation
W
W/°C
V
P
@T = 25°C
C
D
0.3
Linear Derating Factor
± 20
V
Gate-to-Source Voltage
GS
EAS
IAR
71
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
10
4.5
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
5.0
V/ns
-55 to + 175
T
T
J
Storage Temperature Range
Soldering Temperature, for 10 seconds
°C
STG
300 (1.6mm from case )
Thermal Resistance
Parameter
Typ.
Max.
3.3
Units
RθJC
RθJA
RθJA
Junction-to-Case
–––
–––
–––
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
50
°C/W
**
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
02/22/11