AUTOMOTIVE GRADE
AUIRFL014N
HEXFET® Power MOSFET
Features
Advanced Planar Technology
Low On-Resistance
D
S
V(BR)DSS
55V
0.16
Dynamic dV/dT Rating
150°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to Tjmax
RDS(on) max.
ID
Ω
G
1.9A
Lead-Free, RoHS Compliant
Automotive Qualified *
D
Description
Specifically designed for Automotive applications, this
Cellular design of HEXFET® Power MOSFETs utilizes
the latest processing techniques to achieve low on-
resistance per silicon area. This benefit combined with
the fast switching speed and ruggedized device design
that HEXFET power MOSFETs are well known for,
provides the designer with an extremely efficient and
reliable device for use in Automotive and a wide variety
of other applications.
S
D
G
SOT-223
AUIRFL014N
G
D
S
Gate
Drain
Source
Standard Pack
Form
Base part number
Package Type
Orderable Part Number
Quantity
Tube
Tape and Reel
95
2500
AUIRFL014N
AUIRFL014NTR
AUIRFL014N
SOT-223
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is
not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is
25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
2.7
Units
I
I
I
I
@ T = 25°C
A
D
D
D
1.9
@ T = 25°C
A
A
1.5
@ T = 70°C
A
15
DM
2.1
Power Dissipation (PCB Mount)
Power Dissipation (PCB Mount)
Linear Derating Factor (PCB Mount)
Gate-to-Source Voltage
W
W
P
P
@T = 25°C
A
D
D
1.0
@T = 25°C
A
8.3
W/°C
V
±20
V
GS
EAS
IAR
48
1.7
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
EAR
dv/dt
0.1
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
mJ
5.0
V/ns
°C
-55 to + 150
T
T
Operating Junction and
J
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
90
Max.
120
60
Units
RθJA
RθJA
Junction-to-Ambient (PCB mount, steady state)
°C/W
Junction-to-Ambient (PCB mount, steady state)
50
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
1
www.irf.com © 2014 International Rectifier
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March 26, 2014