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AUIRFN7110 PDF预览

AUIRFN7110

更新时间: 2024-09-28 14:54:11
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 536K
描述
100V 单个 N 通道 HEXFET Power MOSFET, 采用 PQFN 5 x 6 E 封装

AUIRFN7110 数据手册

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AUTOMOTIVE GRADE  
AUIRFN7110  
HEXFET® POWER MOSFET  
Features  
 Advanced Process Technology  
 Ultra Low On-Resistance  
 175°C Operating Temperature  
 Fast Switching  
 Repetitive Avalanche Allowed up to Tjmax  
 Lead-Free, RoHS Compliant  
 Automotive Qualified *  
VDSS  
100V  
11.5m  
14.5m  
58A  
RDS(on) typ.  
max  
ID (Silicon Limited)  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
silicon area. Additional features of this design are a 175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating. These features  
combine to make this product an extremely efficient and  
reliable device for use in Automotive and wide variety of  
other applications.  
Applications  
PQFN 5X6 mm  
 Injection  
 DC-DC Converter  
 Automotive Lighting  
 E-Horn  
G
D
S
Gate  
Drain  
Source  
 48V Automotive Systems  
Standard Pack  
Base Part Number  
Package Type  
Orderable Part Number  
Form  
Tape and Reel  
Quantity  
AUIRFN7110  
PQFN 5mm x 6mm  
AUIRFN7110TR  
4000  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Pulsed Drain Current  
Power Dissipation   
Power Dissipation  
Linear Derating Factor   
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)   
Avalanche Current   
Repetitive Avalanche Energy   
Operating Junction and  
Max.  
58  
41  
232  
4.3  
125  
0.029  
± 20  
133  
Units  
ID @ TC(Bottom) = 25°C  
ID @ TC(Bottom) = 100°C  
IDM  
PD @TA = 25°C  
PD @TC(Bottom) = 25°C  
A
W
W/°C  
V
mJ  
VGS  
EAS  
IAR  
EAR  
TJ  
See Fig. 13, 14, 17a, 17b  
-55 to + 175  
A
°C  
TSTG  
Storage Temperature Range  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
1
www.irf.com © 2015 International Rectifier  
Submit Datasheet Feedback  
July 23, 2015  

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