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AUIRFN7107TR PDF预览

AUIRFN7107TR

更新时间: 2024-09-28 01:18:43
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 263K
描述
Advanced Process Technology

AUIRFN7107TR 数据手册

 浏览型号AUIRFN7107TR的Datasheet PDF文件第2页浏览型号AUIRFN7107TR的Datasheet PDF文件第3页浏览型号AUIRFN7107TR的Datasheet PDF文件第4页浏览型号AUIRFN7107TR的Datasheet PDF文件第5页浏览型号AUIRFN7107TR的Datasheet PDF文件第6页浏览型号AUIRFN7107TR的Datasheet PDF文件第7页 
AUTOMOTIVE GRADE  
AUIRFN7107  
Features  
HEXFET® POWER MOSFET  
 Advanced Process Technology  
 Ultra Low On-Resistance  
 175°C Operating Temperature  
 Fast Switching  
 Repetitive Avalanche Allowed up to Tjmax  
 Lead-Free, RoHS Compliant  
 Automotive Qualified *  
VDSS  
75V  
RDS(on) max  
(@VGS = 10V)  
8.5m  
QG (typical)  
51nC  
ID  
Description  
75A  
(@TC (Bottom) = 25°C)  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
silicon are. Additional features of this design are a 175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating. These features  
combine to make this product an extremely efficient and  
reliable device for use in Automotive and wide variety of  
other applications.  
PQFN 5X6 mm  
G
D
S
Applications  
Injection  
Gate  
Drain  
Source  
Heavy Loads  
DC-DC Converter  
Standard Pack  
Base Part Number  
Package Type  
Complete Part Number  
Form  
Quantity  
AUIRFN7107  
PQFN 5mm x 6mm  
Tape and Reel  
4000  
AUIRFN7107TR  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Drain-to-Source Voltage  
Max.  
75  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
ID @ TC(Bottom) = 25°C  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
14  
12  
75  
A
ID @ TC(Bottom) = 100°C  
IDM  
PD @TA = 25°C  
PD @TC(Bottom) = 25°C  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
Power Dissipation  
53  
300  
4.4  
W
Power Dissipation  
125  
Linear Derating Factor  
0.029  
± 20  
123  
W/°C  
V
mJ  
A
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
45  
TJ  
TSTG  
Operating Junction and  
Storage Temperature Range  
-55 to + 175  
°C  
HEXFET® is a registered trademark of Infineon.  
*Qualification standards can be found at www.infineon.com  
1
2015-10-12  

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