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SI2312 PDF预览

SI2312

更新时间: 2024-11-18 09:26:15
品牌 Logo 应用领域
金誉半导体 - HTSEMI /
页数 文件大小 规格书
3页 1878K
描述
20 V N-Channel Enhancement Mode MOSFET

SI2312 数据手册

 浏览型号SI2312的Datasheet PDF文件第2页浏览型号SI2312的Datasheet PDF文件第3页 
SI2312  
20V N-Channel Enhancement Mode MOSFET  
VDS= 20V  
RDS(ON), Vgs@4.5V, Ids@5.0A < 31m  
RDS(ON), Vgs@2.5V, Ids@4.5A < 37mΩ  
RDS(ON), Vgs@1.8V, Ids@3.9A < 85mΩ  
Features  
Advanced trench process technology  
High Density Cell Design For Ultra Low On-Resistance  
Package Dimensions  
D
SOT-23-3L  
G
S
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
Max.  
3.10  
2.95  
1.70  
0.50  
0.10  
Min.  
Max.  
A
B
C
D
E
2.70  
2.65  
1.50  
0.35  
0
G
H
K
J
1.90 REF.  
1.00  
0.10  
0.40  
0.85  
1.30  
0.20  
-
L
1.15  
F
0.45  
0.55  
M
0°  
10°  
Maximum Ratings and Thermal Characteristics (TA = 25oC unless otherwise noted)  
Parameter  
Symbol  
VDS  
VGS  
ID  
Limit  
20  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain Current  
Pulsed Drain Current  
V
+ 8  
4.9  
A
IDM  
15  
TA = 25oC  
TA = 75oC  
0.75  
0.48  
-55 to 150  
140  
Maximum Power Dissipation  
PD  
W
oC  
oC/W  
TJ, Tstg  
RqJA  
Operating Junction and Storage Temperature Range  
Junction-to-Ambient Thermal Resistance (PCB mounted)  
1
JinYu  
semiconductor  
www.htsemi.com  
Date:2011/05  

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