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RN1107FS PDF预览

RN1107FS

更新时间: 2024-11-02 12:05:43
品牌 Logo 应用领域
东芝 - TOSHIBA 开关驱动
页数 文件大小 规格书
6页 346K
描述
Switching, Inverter Circuit, Interface Circuit and Driver Circuit Applications

RN1107FS 技术参数

生命周期:Obsolete包装说明:FSM, 2-1E1A, 3 PIN
针数:3Reach Compliance Code:unknown
风险等级:5.7其他特性:BUILT-IN BIAS RESISTOR RATIO IS 4.7
最大集电极电流 (IC):0.05 A集电极-发射极最大电压:20 V
配置:SINGLE WITH BUILT-IN RESISTOR最小直流电流增益 (hFE):120
JESD-30 代码:R-PDSO-F3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:NPN
认证状态:Not Qualified表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

RN1107FS 数据手册

 浏览型号RN1107FS的Datasheet PDF文件第2页浏览型号RN1107FS的Datasheet PDF文件第3页浏览型号RN1107FS的Datasheet PDF文件第4页浏览型号RN1107FS的Datasheet PDF文件第5页浏览型号RN1107FS的Datasheet PDF文件第6页 
RN1107~1109  
TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)  
RN1107, RN1108, RN1109  
Switching, Inverter Circuit, Interface Circuit  
and Driver Circuit Applications  
Unit: mm  
z With built-in bias resistors.  
z Simplified circuit design  
z Reduced number of parts and simplified manufacturing process  
z Complementary to RN2107 to 2109  
Equivalent Circuit and Bias Resistor Values  
Type No.  
R1 (k)  
R2 (k)  
RN1107  
RN1108  
RN1109  
10  
22  
47  
47  
47  
22  
JEDEC  
JEITA  
TOSHIBA  
2-2H1A  
Weight: 2.4mg (typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Collector-base voltage  
Symbol  
Rating  
Unit  
RN1107 to 1109  
RN1107 to 1109  
RN1107  
V
V
50  
V
V
CBO  
CEO  
Collector-emitter voltage  
50  
6
7
Emitter-base voltage  
V
V
RN1108  
EBO  
RN1109  
15  
Collector current  
RN1107 to 1109  
RN1107 to 1109  
RN1107 to 1109  
RN1107 to 1109  
I
100  
mA  
mW  
°C  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
100  
C
T
150  
j
T
stg  
55 to 150  
°C  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2010-04-06  

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