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NTJD2152PT2 PDF预览

NTJD2152PT2

更新时间: 2024-11-01 03:27:35
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 57K
描述
Trench Small Signal MOSFET

NTJD2152PT2 数据手册

 浏览型号NTJD2152PT2的Datasheet PDF文件第2页浏览型号NTJD2152PT2的Datasheet PDF文件第3页浏览型号NTJD2152PT2的Datasheet PDF文件第4页浏览型号NTJD2152PT2的Datasheet PDF文件第5页浏览型号NTJD2152PT2的Datasheet PDF文件第6页 
NTJD2152P  
Trench Small Signal  
MOSFET  
8 V, Dual P−Channel, SC−88  
ESD Protection  
http://onsemi.com  
Features  
Leading –8 V Trench for Low R  
ESD Protected Gate  
Small Footprint (2 x 2 mm)  
Same Package as SC−70−6  
Performance  
DS(ON)  
V
R
TYP  
I Max  
D
(BR)DSS  
DS(on)  
0.22 W @ −4.5 V  
0.32 W @ −2.5 V  
−8 V  
−0.775 A  
Pb−Free Package May be Available. The G−Suffix Denotes a  
0.51 W @ −1.8 V  
Pb−Free Lead Finish  
SOT−363  
Applications  
SC−88 (6 LEADS)  
Load Power switching  
DC−DC Conversion  
Li−Ion Battery Charging Circuits  
Cell Phones, Media Players, Digital Cameras, PDAs  
S
1
6
5
4
D
1
1
G
2
3
G
2
1
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
−8.0  
Unit  
V
V
DSS  
D
S
2
2
Gate−to−Source Voltage  
V
GS  
±8.0  
V
Continuous Drain  
Current  
Steady T = 25 °C  
I
−0.775  
−0.558  
0.27  
A
A
D
Top View  
State  
T = 85 °C  
A
(Based on R  
)
q
JA  
MARKING DIAGRAM  
Power Dissipation  
(Based on R  
Steady T = 25 °C  
P
W
A
A
D
6
)
State  
q
JA  
T = 85 °C  
A
0.14  
1
TAD  
Continuous Drain  
Current  
Steady T = 25 °C  
I
D
−1.1  
A
SC−88 (SOT−363)  
CASE 419B  
Style 26  
State  
T = 85 °C  
A
−0.8  
(Based on R  
)
q
JL  
Power Dissipation  
(Based on R  
Steady T = 25 °C  
0.55  
W
TA  
D
= Device Code  
= Date Code  
A
)
State  
q
JL  
P
D
T = 85 °C  
A
0.29  
Pulsed Drain Current  
t 10 ms  
I
±1.2  
A
DM  
PIN ASSIGNMENT  
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
1
6
°C  
J
T
STG  
Source−1  
Gate−1  
Drain−1  
Gate−2  
Continuous Source Current (Body Diode)  
I
S
−0.775  
260  
A
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
Drain−2  
Source−2  
Top View  
THERMAL RESISTANCE RATINGS (Note 1)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
Parameter  
Symbol Typ  
Max Unit  
460 °C/W  
226  
Junction−to−Ambient – Steady State  
Junction−to−Lead (Drain) – Steady State  
R
400  
194  
q
JA  
R
q
JL  
1. Surface mounted on FR4 board using 1 oz Cu area = 0.9523 in sq.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
January, 2004 − Rev. 2  
NTJD2152/D  

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