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JANSG2N7268U

更新时间： 2024-11-20 22:28:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 286K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-1)

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中文翻译

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JANSG2N7268U 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：HERMETIC SEALED, CERAMIC, SMD-1, 3 PINReach Compliance Code：compliant
ECCN代码：EAR99风险等级：5.72
其他特性：RADIATION HARDENED雪崩能效等级（Eas）：500 mJ
外壳连接：DRAIN配置：SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压：100 V最大漏极电流 (ID)：34 A
最大漏源导通电阻：0.07 ΩFET 技术：METAL-OXIDE SEMICONDUCTOR
JESD-30 代码：R-CBCC-N3JESD-609代码：e0
元件数量：1端子数量：3
工作模式：ENHANCEMENT MODE封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装形状：RECTANGULAR封装形式：CHIP CARRIER
峰值回流温度（摄氏度）：NOT SPECIFIED极性/信道类型：N-CHANNEL
最大脉冲漏极电流 (IDM)：136 A认证状态：Qualified
参考标准：MIL-19500/603表面贴装：YES
端子面层：Tin/Lead (Sn/Pb)端子形式：NO LEAD
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
晶体管应用：SWITCHING晶体管元件材料：SILICON
Base Number Matches：1

JANSG2N7268U 数据手册

 浏览型号JANSG2N7268U的Datasheet PDF文件第2页浏览型号JANSG2N7268U的Datasheet PDF文件第3页浏览型号JANSG2N7268U的Datasheet PDF文件第4页浏览型号JANSG2N7268U的Datasheet PDF文件第5页浏览型号JANSG2N7268U的Datasheet PDF文件第6页浏览型号JANSG2N7268U的Datasheet PDF文件第7页 
PD - 90720C  
IRHN7150  
JANSR2N7268U  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-1)  
100V, N-CHANNEL  
REF: MIL-PRF-19500/603  
RAD Hard™ HEXFET® TECHNOLOGY  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
QPL Part Number  
IRHN7150  
IRHN3150  
IRHN4150  
IRHN8150  
100K Rads (Si) 0.065Ω  
300K Rads (Si) 0.065Ω  
600K Rads (Si) 0.065Ω  
1000K Rads (Si) 0.065Ω  
34A JANSR2N7268U  
34A JANSF2N7268U  
34A JANSG2N7268U  
34A JANSH2N7268U  
SMD-1  
International Rectifier’s RADHard HEXFET® technol-  
ogy provides high performance power MOSFETs for  
space applications. This technology has over a de-  
cade of proven performance and reliability in satellite  
applications. These devices have been character-  
ized for bothTotal Dose and Single Event Effects (SEE).  
The combination of low Rdson and low gate charge  
reduces the power losses in switching applications  
such as DC to DC converters and motor control. These  
devices retain all of the well established advantages  
of MOSFETs such as voltage control, fast switching,  
ease of paralleling and temperature stability of elec-  
trical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
34  
D
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
21  
136  
D
GS  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
150  
W
W/°C  
V
D
C
Linear Derating Factor  
1.2  
V
Gate-to-Source Voltage  
±20  
GS  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
500  
mJ  
A
AS  
I
34  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
15  
mJ  
V/ns  
AR  
dv/dt  
5.5  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
PCKG. Mounting Surface Temp.  
Weight  
300 ( for 5s)  
2.6 (Typical )  
For footnotes refer to the last page  
www.irf.com  
1
02/01/01  
1234567...12

中文翻译

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