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IXTN8N150L PDF预览

IXTN8N150L

更新时间: 2024-11-21 14:18:27
品牌 Logo 应用领域
IXYS 局域网开关脉冲晶体管
页数 文件大小 规格书
5页 149K
描述
Power Field-Effect Transistor, 7.5A I(D), 1500V, 3.6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, MINIBLOC-4

IXTN8N150L 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred包装说明:FLANGE MOUNT, R-PUFM-X4
针数:4Reach Compliance Code:compliant
风险等级:5.73Is Samacsys:N
其他特性:UL RECOGNIZED外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:1500 V
最大漏极电流 (Abs) (ID):7.5 A最大漏极电流 (ID):7.5 A
最大漏源导通电阻:3.6 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PUFM-X4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):545 W最大脉冲漏极电流 (IDM):20 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Nickel (Ni)
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXTN8N150L 数据手册

 浏览型号IXTN8N150L的Datasheet PDF文件第2页浏览型号IXTN8N150L的Datasheet PDF文件第3页浏览型号IXTN8N150L的Datasheet PDF文件第4页浏览型号IXTN8N150L的Datasheet PDF文件第5页 
Linear Power MOSFET  
w/Extended FBSOA  
VDSS  
ID25  
RDS(on) 3.6Ω  
= 1500V  
= 7.5A  
IXTN8N150L  
D
S
N-Channel Enhancement Mode  
Guaranteed FBSOA  
G
S
miniBLOC, SOT-227 B  
E153432  
S
G
Symbol  
VDSS  
Test Conditions  
Maximum Ratings  
TJ = 25°C to 150°C  
1500  
1500  
V
V
VDGR  
TJ = 25°C to 150°C, RGS = 1MΩ  
S
VGSS  
VGSM  
Continuous  
Transient  
±30  
±40  
V
V
D
ID25  
IDM  
TC = 25°C  
7.5  
20  
A
A
G = Gate  
S = Source  
D = Drain  
S = Source  
TC = 25°C, Pulse Width Limited by TJM  
PD  
TC = 25°C  
545  
W
TJ  
-55 to +150  
150  
°C  
°C  
°C  
Features  
TJM  
Tstg  
-55 to +150  
z Designed for Linear Operations  
z International Standard Package  
z Molding Epoxies Meet UL94 V-0  
Flammability Classification  
z Guaranteed FBSOA at 60ºC  
z miniBLOC with Aluminum Nitride  
Isolation  
VISOL  
50/60 Hz, RMS, t = 1minute  
2500  
3000  
V~  
V~  
IISOL 1mA,  
t = 1s  
Md  
Mounting Torque for Base Plate  
Terminal Connection Torque  
1.5/13  
1.3/11.5  
Nm/lb.in.  
Nm/lb.in.  
Weight  
30  
g
z Low RDS(on) HDMOSTM Process  
z Rugged Polysilicon Gate Cell  
Structure  
z Low Package Inductance  
Applications  
Symbol  
Test Conditions  
Characteristic Values  
Min. Typ. Max.  
(TJ = 25°C, Unless Otherwise Specified)  
z Programmable Loads  
z Current Regulators  
z DC-DC Convertors  
z Battery Chargers  
z DC Choppers  
z Temperature and Lighting Controls  
BVDSS  
VGS(th)  
IGSS  
VGS = 0V, ID = 1mA  
VDS = VGS, ID = 250µA  
VGS = ±30V, VDS = 0V  
VDS = VDSS, VGS= 0V  
1500  
5.0  
V
8.0  
V
±200 nA  
IDSS  
25 µA  
TJ = 125°C  
500 µA  
RDS(on)  
VGS = 20V, ID = 4A, Note 1  
3.6  
Advantages  
z
Easy to Mount  
Space Savings  
High Power Density  
z
z
DS99815B(3/13)  
© 2013 IXYS CORPORATION, All rights reserved  

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