IXTK 21N100 VDSS = 1000 V
IXTN 21N100 ID25 = 21 A
High Voltage
MegaMOSTMFETs
RDS(on) = 0.55 Ω
N-Channel,EnhancementMode
TO-264 AA (IXTK)
Symbol
Test Conditions
MaximumRatings
IXTK
IXTN
VDSS
VDGR
TJ = 25°C to 150°C
1000
1000
1000
1000
V
V
G
D(TAB)
D
S
TJ = 25°C to 150°C; RGS = 1 MΩ
VGS
Continuous
Transient
±20
±30
±20
±30
V
V
miniBLOC, SOT-227 B
E153432
VGSM
S
ID25
IDM
TC = 25°C, Chip capability
21
84
21
84
A
A
G
D
TC = 25°C, pulse width limited by TJM
PD
TC = 25°C
500
520
W
G
S
TJ
-55 ... +150
150
-55 ... +150
300
°C
°C
°C
S
D
TJM
Tstg
S
G = Gate
S = Source
D = Drain
TAB = Drain
TL
1.6 mm (0.063 in) from case for 10 s
-
°C
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
VISOL
50/60Hz, RMS
ISOL ≤ 1 mA
t = 1 min
t = 1 s
-
-
2500
3000
V~
V~
I
Md
Mountingtorque
Terminalconnectiontorque
0.9/6
-
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
Features
Internationalstandardpackages
JEDECTO-264,epoxymeetUL94V-0
flammabilityclassification
Weight
10
30
g
miniBLOC,(ISOTOP-compatible)with
Aluminiumnitrideisolation
Low RDS (on) HDMOSTM process
Rugged polysilicon gate cell structure
Lowpackageinductance
Applications
Symbol
Test Conditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
DC-DC converters
Synchronousrectification
Batterychargers
Switched-modeandresonant-mode
powersupplies
DC choppers
VDSS
VGS = 0 V, ID = 6 mA
1000
2
V
V
VGH(th)
VDS = VGS, ID = 500 µA
4.5
IGSS
IDSS
VGS = ±20 VDC, VDS = 0
±200 nA
500 µA
Temperatureandlightingcontrols
VDS = 0.8 • VDSS
VGS = 0 V
TJ = 25°C
TJ = 125°C
Advantages
2
mA
Easy to mount
Space savings
Highpowerdensity
RDS(on)
VGS = 10 V, ID = 0.5 • ID25
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
0.55
Ω
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
92808I(5/97)
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