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IXFR26N50Q PDF预览

IXFR26N50Q

更新时间: 2024-11-24 23:13:27
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IXYS 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
2页 82K
描述
HiPerFET Power MOSFETs ISOPLUS247 (Electrically Isolated Back Surface)

IXFR26N50Q 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:compliant
风险等级:5.75Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1500 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):24 A
最大漏极电流 (ID):24 A最大漏源导通电阻:0.2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):250 W最大脉冲漏极电流 (IDM):104 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFR26N50Q 数据手册

 浏览型号IXFR26N50Q的Datasheet PDF文件第2页 
HiPerFETTM Power MOSFETs  
ISOPLUS247TM  
VDSS  
ID25  
RDS(on)  
IXFR 26N50Q 500 V  
IXFR 24N50Q 500 V  
24 A  
22 A  
0.20 Ω  
0.23 Ω  
(Electrically Isolated Back Surface)  
t 250 ns  
rr  
N-ChannelEnhancementMode  
High dV/dt, Low trr, HDMOSTM Family  
Symbol  
TestConditions  
Maximum Ratings  
ISOPLUS247TM  
E153432  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
500  
500  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
G
D
Isolated back surface*  
ID25  
IDM  
IAR  
TC = 25°C  
26N50Q  
24N50Q  
26N50Q  
24N50Q  
26N50Q  
24N50Q  
24  
22  
104  
96  
26  
24  
A
A
A
A
A
A
TC = 25°C, Pulse width limited by TJM  
TC = 25°C  
G = Gate  
S = Source  
D = Drain  
* Patent pending  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
30  
1.5  
mJ  
J
Features  
Silicon chip on Direct-Copper-Bond  
substrate  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
l
PD  
TC = 25°C  
250  
W
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
l
l
l
l
Low drain to tab capacitance(<35pF)  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
TL  
1.6 mm (0.062 in.) from case for 10 s  
300  
2500  
5
°C  
V~  
g
VISOL  
Weight  
50/60 Hz, RMS  
t = 1 minute leads-to-tab  
l
Fast intrinsic Rectifier  
Applications  
l
DC-DC converters  
l
Battery chargers  
Symbol  
VDSS  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
l
Switched-mode and resonant-mode  
power supplies  
DC choppers  
min. typ. max.  
l
VGS = 0 V, ID = 250uA  
500  
2.5  
V
V
l
AC motor control  
VGS(th)  
IGSS  
VDS = VGS, ID = 4mA  
4.5  
Advantages  
l
Easyassembly:noscrews,orisolation  
VGS = ±20 VDC, VDS = 0  
±100 nA  
foils required  
Space savings  
IDSS  
VDS = 0.8 VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
25  
1
µA  
mA  
l
l
High power density  
l
RDS(on)  
VGS = 10 V, ID = IT  
Notes 1 & 2  
26N50Q  
24N50Q  
0.20  
0.23  
Low collector capacitance to ground  
(lowEMI)  
98664A (5/01)  
© 2001 IXYS All rights reserved  

IXFR26N50Q 替代型号

型号 品牌 替代类型 描述 数据表
IXFR24N50Q IXYS

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HiPerFET Power MOSFETs ISOPLUS247 (Electrically Isolated Back Surface)
IXFR24N50 IXYS

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HiPerFET Power MOSFETs ISOPLUS247 (Electrically Isolated Back Surface)

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