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IXFK30N50Q PDF预览

IXFK30N50Q

更新时间: 2024-02-19 21:40:00
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
4页 114K
描述
HiPerFET Power MOSFETs Q-Class

IXFK30N50Q 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-264AA
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliant风险等级:5.83
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (ID):30 A
最大漏源导通电阻:0.16 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-264AAJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):120 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFK30N50Q 数据手册

 浏览型号IXFK30N50Q的Datasheet PDF文件第2页浏览型号IXFK30N50Q的Datasheet PDF文件第3页浏览型号IXFK30N50Q的Datasheet PDF文件第4页 
HiPerFETTM  
Power MOSFETs  
Q-Class  
VDSS ID25  
RDS(on)  
IXFK/IXFX 30N50Q  
IXFK/IXFX 32N50Q  
500 V 30 A 0.16 Ω  
500 V 32 A 0.15 Ω  
t 250 ns  
rr  
N-ChannelEnhancementMode  
AvalancheRated, LowQg,Highdv/dt  
Symbol  
TestConditions  
Maximum Ratings  
PLUS247TM  
(IXFK)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
500  
500  
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
(TAB)  
G
VGSM  
D
ID25  
IDM  
TC = 25°C  
TC = 25°C,  
30N50Q  
32N50Q  
30N50Q  
32N50Q  
30  
32  
120  
128  
A
A
A
A
TO-264AA(IXFK)  
pulse width limited by TJM  
TC = 25°C  
IAR  
32  
A
G
D
(TAB)  
EAR  
EAS  
TC = 25°C  
45  
mJ  
mJ  
S
1500  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
5
V/ns  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
PD  
TC = 25°C  
416  
W
TJ  
TJM  
Tstg  
-55 ... + 150  
150  
-55 ... + 150  
°C  
°C  
°C  
Features  
TL  
1.6 mm (0.063 in) from case for 10 s  
Mounting torque  
300  
°C  
l
IXYS advanced low Qg process  
Md  
1.13/10  
Nm/lb.in.  
l
Low gate charge and capacitances  
- easier to drive  
Weight  
TO-247  
TO-268  
6
4
g
g
- faster switching  
International standard packages  
Low RDS (on)  
l
l
l
Unclamped Inductive Switching (UIS)  
rated  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
l
Molding epoxies meet UL 94 V-0  
flammability classification  
min.  
typ.  
max.  
VDSS  
VGS = 0 V, ID = 250 uA  
VDS = VGS, ID = 4 mA  
500  
V
V
VGS(th)  
2.5  
4.5  
Advantages  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100  
nA  
l
TM  
PLUS 247 package for clip or spring  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
100  
1
µA  
mA  
mounting  
l
l
Space savings  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
Note 1  
32N50Q  
30N50Q  
0.15  
0.16  
High power density  
98604D (06/02)  
© 2002 IXYS All rights reserved  

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