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IRHN7250PBF

更新时间: 2024-11-18 13:08:51
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
14页 534K
描述
Power Field-Effect Transistor, 26A I(D), 200V, 0.11ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN

IRHN7250PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:CHIP CARRIER, R-CBCC-N3Reach Compliance Code:compliant
风险等级:5.84其他特性:RADIATION HARDENED
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (ID):26 A最大漏源导通电阻:0.11 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CBCC-N3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):104 A
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRHN7250PBF 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
Provisional Data Sheet PD 9.679C  
IRHN7250  
IRHN8250  
N-CHANNEL  
MEGA RAD HARD  
REPETITIVE AVALANCHE AND dv/dt RATED  
HEXFET® TRANSISTOR  
Product Summary  
200 Volt, 0.10, MEGA RAD HARD HEXFET  
International Rectifier’s MEGA RAD HARD technology  
HEXFET power MOSFETs demonstrate excellent  
threshold voltage stability and breakdown voltage sta-  
bility at total radiation doses as high as 1 x 106 Rads  
(Si). Under identical pre- and post-radiation test con-  
ditions, International Rectifier’s RAD HARD HEXFETs  
retain identical electrical specifications up to 1 x 105  
Rads (Si) total dose. At 1 x 106 Rads (Si) total dose,  
under the same pre-dose conditions, only minor shifts  
in the electrical specifications are observed and are so  
specified in table 1. No compensation in gate drive cir-  
cuitry is required. In addition, these devices are capable  
of surviving transient ionization pulses as high as 1 x  
1012 Rads (Si)/Sec, and return to normal operation within  
a few microseconds. Single Event Effect (SEE) testing  
of International Rectifier RAD HARD HEXFETs has dem-  
onstrated virtual immunity to SEE failure. Since the  
MEGA RAD HARD process utilizes International  
Rectifier’s patented HEXFET technology, the user can  
expect the highest quality and reliability in the industry.  
Part Number  
IRHN7250  
IRHN8250  
BVDSS  
200V  
RDS(on)  
0.10Ω  
0.10Ω  
ID  
26A  
26A  
200V  
Features:  
Radiation Hardened up to 1 x 106 Rads (Si)  
Single Event Burnout (SEB) Hardened  
Single Event Gate Rupture (SEGR) Hardened  
Gamma Dot (Flash X-Ray) Hardened  
Neutron Tolerant  
Identical Pre- and Post-Electrical Test Conditions  
Repetitive Avalanche Rating  
Dynamic dv/dt Rating  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
Light-weight  
RAD HARD HEXFET transistors also feature all of the  
well-established advantages of MOSFETs, such as volt-  
age control, very fast switching, ease of paralleling and  
temperature stability of the electrical parameters.  
They are well-suited for applications such as switching  
power supplies, motor controls, inverters, choppers, au-  
dio amplifiers and high-energy pulse circuits in space  
and weapons environments.  
Absolute Maximum Ratings  
Pre-Radiation  
Parameter  
IRHN7250, IRHN8250  
Units  
I
@ V  
= 12V, T = 25°C Continuous Drain Current  
26  
D
GS  
C
A
I
D
@ V  
= 12V, T = 100°C Continuous Drain Current  
C
16  
GS  
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
104  
DM  
@ T = 25°C  
P
150  
W
W/K ➄  
V
D
C
Linear Derating Factor  
1.2  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy ➁  
Avalanche Current ➀  
±20  
GS  
E
500  
mJ  
AS  
I
26  
A
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➂  
Operating Junction  
15  
mJ  
AR  
dv/dt  
5.0  
V/ns  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
(for 5 sec.)  
Package Mounting Surface Temperature  
Weight  
300  
2.6 (typical)  
F-347  
To Order  
 
 

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