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IRHN9150 PDF预览

IRHN9150

更新时间: 2024-11-17 22:48:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲
页数 文件大小 规格书
4页 88K
描述
TRANSISTOR P-CHANNEL(BVdss=-100V, Rds(on)=0.120ohm, Id=-22A)

IRHN9150 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:SMD-1, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.13
Is Samacsys:N其他特性:RADIATION HARDENED
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):22 A最大漏极电流 (ID):22 A
最大漏源导通电阻:0.085 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):150 W最大脉冲漏极电流 (IDM):88 A
认证状态:Not Qualified参考标准:RH - 100K Rad(Si)
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):380 ns最大开启时间(吨):210 ns
Base Number Matches:1

IRHN9150 数据手册

 浏览型号IRHN9150的Datasheet PDF文件第2页浏览型号IRHN9150的Datasheet PDF文件第3页浏览型号IRHN9150的Datasheet PDF文件第4页 
Previous Datasheet  
Index  
Next Data Sheet  
Provisional Data Sheet No. PD-9.885  
REPETITIVE AVALANCHE AND dv/dt RATED  
HEXFET® TRANSISTOR  
IRHN9150  
P-CHANNEL  
RAD HARD  
-100 Volt, 0.120, RAD HARD HEXFET  
Product Summary  
International Rectifier’s P-channel RAD HARD tech-  
nology HEXFETs demonstrate excellent threshold  
voltage stability and breakdown voltage stability at  
total radiation doses as high as 105 Rads (Si). Under  
Part Number  
BVDSS  
RDS(on)  
ID  
IRHN9150  
-100V  
0.120Ω  
-22A  
identical pre- and post-radiation test conditions, In- Features:  
Radiation Hardened up to 1 x 105 Rads (Si)  
Single Event Burnout (SEB) Hardened  
Single Event Gate Rupture (SEGR) Hardened  
Gamma Dot (Flash X-Ray) Hardened  
Neutron Tolerant  
ternational Rectifiers P-channelRAD HARD HEXFETs  
retain identical electrical specifications up to 1 x 105  
Rads (Si) total dose. No compensation in gate drive  
circuitry is required. These devices are also capable  
of surviving transient ionization pulses as high as 1 x  
1012 Rads (Si)/Sec, and return to normal operation  
within a few microseconds.Single Event Effect, (SEE),  
Identical Pre- and Post-Electrical Test Conditions  
testing of International Rectifier’s P-channel RAD Repetitive Avalanche Rating  
HARD HEXFETs has demonstrated virtual immunity  
to SEE failure. Since the P-channel RAD HARD pro-  
cess utilizes International Rectifier’s patented HEXFET  
technology, the user can expect the highest quality  
and reliability in the industry.  
P-channel RAD HARD HEXFET transistors also fea-  
ture all of the well-established advantages of MOS-  
FETs, such as voltage control, very fast switching, ease  
of paralleling and temperature stability of the electri-  
cal parameters.  
Dynamic dv/dt Rating  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
Lightweight  
They are well-suited for applications such as switch-  
ing power supplies, motor controls, inverters, chop-  
pers, audio amplifiers and high-energy pulse circuits  
in space and weapons environments.  
Pre-Radiation  
Absolute Maximum Ratings  
Parameter  
= -12V, T = 25°C Continuous Drain Current  
C
IRHN9150  
-22  
Units  
I
@ V  
D
GS  
A
I
D
@ V  
= -12V, T = 100°C Continuous Drain Current  
-14  
GS  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
-88  
DM  
@ T = 25°C  
P
D
150  
W
W/K ➄  
V
C
1.2  
V
±20  
GS  
E
Single Pulse Avalanche Energy ➁  
Avalanche Current ➀  
500  
-22  
mJ  
AS  
I
A
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➂  
Operating Junction  
15  
mJ  
AR  
dv/dt  
-5.5  
V/ns  
T
-55 to 150  
J
T
Storage Temperature Range  
Package Mount Surface Temperature  
Weight  
STG  
oC  
300 (for 5 seconds)  
2.6 (typical)  
g
To Order  
 
 

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