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IRHN9250

更新时间: 2024-11-05 04:23:11
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 128K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-1)

IRHN9250 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:CHIP CARRIER, R-CBCC-N3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.32
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (Abs) (ID):14 A
最大漏极电流 (ID):14 A最大漏源导通电阻:0.33 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CBCC-N3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):150 W最大脉冲漏极电流 (IDM):56 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON

IRHN9250 数据手册

 浏览型号IRHN9250的Datasheet PDF文件第2页浏览型号IRHN9250的Datasheet PDF文件第3页浏览型号IRHN9250的Datasheet PDF文件第4页浏览型号IRHN9250的Datasheet PDF文件第5页浏览型号IRHN9250的Datasheet PDF文件第6页浏览型号IRHN9250的Datasheet PDF文件第7页 
PD - 91300D  
IRHN9250  
JANSR2N7423U  
200V, P-CHANNEL  
REF: MIL-PRF-19500/662  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-1)  
RAD HardHEXFET® TECHNOLOGY  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
QPL Part Number  
JANSR2N7423U  
JANSF2N7423U  
IRHN9250  
100K Rads (Si)  
0.315Ω  
0.315Ω  
-14A  
-14A  
IRHN93250 300K Rads (Si)  
SMD-1  
International Rectifier’s RADHard HEXFETTM technol-  
ogy provides high performance power MOSFETs for  
space applications. This technology has over a de-  
cade of proven performance and reliability in satellite  
applications. These devices have been character-  
ized for bothTotal Dose and Single Event Effects (SEE).  
The combination of low Rdson and low gate charge  
reduces the power losses in switching applications  
such as DC to DC converters and motor control. These  
devices retain all of the well established advantages  
of MOSFETs such as voltage control, fast switching,  
ease of paralleling and temperature stability of elec-  
trical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
LowTotal Gate Charge  
ProtonTolerant  
SimpleDriveRequirements  
EaseofParalleling  
Hermetically Sealed  
Surface Mount  
CeramicPackage  
LightWeight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= -12V, T = 25°C Continuous Drain Current  
-14  
-9.0  
D
D
GS  
GS  
C
A
I
= -12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
Linear Derating Factor  
-56  
DM  
@ T = 25°C  
P
D
150  
W
W/°C  
V
C
1.2  
V
GS  
Gate-to-SourceVoltage  
±20  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
500  
mJ  
A
AS  
I
-14  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
15  
mJ  
AR  
dv/dt  
-41  
V/ns  
T
-55 to 150  
J
oC  
g
T
STG  
StorageTemperature Range  
PCKG Mounting Surface Temp.  
Weight  
300 ( for 5s)  
2.6 (typical)  
For footnotes refer to the last page  
www.irf.com  
1
06/06/03  

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