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IRHN8450SCS PDF预览

IRHN8450SCS

更新时间: 2024-11-18 21:11:23
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
8页 345K
描述
Power Field-Effect Transistor,

IRHN8450SCS 技术参数

生命周期:Active包装说明:CHIP CARRIER, R-CBCC-N3
Reach Compliance Code:compliant风险等级:5.71
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):11 A最大漏极电流 (ID):11 A
最大漏源导通电阻:0.5 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):150 W最大脉冲漏极电流 (IDM):44 A
参考标准:MIL-19500表面贴装:YES
端子形式:NO LEAD端子位置:BOTTOM
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):320 ns最大开启时间(吨):235 ns
Base Number Matches:1

IRHN8450SCS 数据手册

 浏览型号IRHN8450SCS的Datasheet PDF文件第2页浏览型号IRHN8450SCS的Datasheet PDF文件第3页浏览型号IRHN8450SCS的Datasheet PDF文件第4页浏览型号IRHN8450SCS的Datasheet PDF文件第5页浏览型号IRHN8450SCS的Datasheet PDF文件第6页浏览型号IRHN8450SCS的Datasheet PDF文件第7页 
PD-90819C  
IRHN7450  
JANSR2N7270U  
500V, N-CHANNEL  
REF: MIL-PRF-19500/603  
RAD-Hard HEXFET TECHNOLOGY  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-1)  
Product Summary  
Part Number  
IRHN7450  
IRHN3450  
IRHN4450  
IRHN8450  
Radiation Level  
100 kRads(Si)  
300 kRads(Si)  
500 kRads(Si)  
1000 kRads(Si)  
RDS(on)  
ID  
QPL Part Number  
JANSR2N7270U  
JANSF2N7270U  
JANSG2N7270U  
JANSH2N7270U  
11A  
11A  
11A  
11A  
0.45  
0.45  
0.45  
0.45  
Features  
Description  
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Electrically Isolated  
Ceramic package  
IR HiRel RAD-Hard HEXFETtechnology provides high performance  
power MOSFETs for space applications. This technology  
has over a decade of proven performance and reliability in  
satellite applications. These devices have been characterized  
for both Total Dose and Single Event Effects (SEE). The  
combination of low Rdson and low gate charge reduces  
the power losses in switching applications such as DC to  
DC converters and motor control. These devices retain all  
of the well established advantages of MOSFETs such as  
voltage control, fast switching, ease of paralleling and  
temperature stability of electrical parameters.  
Light Weight  
Surface Mount  
ESD Rating: Class 3A per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Parameter  
Pre-Irradiation  
Units  
11  
ID @ VGS = 12V, TC = 25°C Continuous Drain Current  
ID @ VGS = 12V, TC = 100°C Continuous Drain Current  
7.0  
44  
A
IDM  
Pulsed Drain Current  
150  
1.2  
W
W/°C  
V
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
± 20  
500  
VGS  
EAS  
IAR  
mJ  
A
11  
15  
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt   
Operating Junction and  
Storage Temperature Range  
Lead Temperature  
3.5  
-55 to + 150  
TSTG  
°C  
g
300 (for 5s)  
2.6 (Typical)  
Weight  
For Footnotes, refer to the page 2.  
1
2016-06-30  

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