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IRGB15B60KD PDF预览

IRGB15B60KD

更新时间: 2024-11-04 22:17:51
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管双极型晶体管电动机控制局域网超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
16页 325K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

IRGB15B60KD 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5.12其他特性:ULTRA FAST
外壳连接:COLLECTOR最大集电极电流 (IC):31 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:MOTOR CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):231 ns
标称接通时间 (ton):52 nsBase Number Matches:1

IRGB15B60KD 数据手册

 浏览型号IRGB15B60KD的Datasheet PDF文件第2页浏览型号IRGB15B60KD的Datasheet PDF文件第3页浏览型号IRGB15B60KD的Datasheet PDF文件第4页浏览型号IRGB15B60KD的Datasheet PDF文件第5页浏览型号IRGB15B60KD的Datasheet PDF文件第6页浏览型号IRGB15B60KD的Datasheet PDF文件第7页 
PD - 94383C  
IRGB15B60KD  
IRGS15B60KD  
IRGSL15B60KD  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
C
VCES = 600V  
Features  
• Low VCE (on) Non Punch Through IGBT Technology.  
• Low Diode VF.  
• 10µs Short Circuit Capability.  
• Square RBSOA.  
• Ultrasoft Diode Reverse Recovery Characteristics.  
• Positive VCE (on) Temperature Coefficient.  
IC = 15A, TC=100°C  
tsc > 10µs, TJ=150°C  
VCE(on) typ. = 1.8V  
G
E
n-channel  
Benefits  
• Benchmark Efficiency for Motor Control.  
• Rugged Transient Performance.  
• Low EMI.  
• Excellent Current Sharing in Parallel Operation.  
D2Pak  
TO-262  
TO-220AB  
IRGB15B60KD  
IRGS15B60KD IRGSL15B60KD  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current  
600  
V
IC @ TC = 25°C  
IC @ TC = 100°C  
ICM  
31  
15  
62  
ILM  
Clamped Inductive Load Current  
Diode Continuous Forward Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
62  
A
IF @ TC = 25°C  
IF @ TC = 100°C  
IFM  
31  
15  
64  
VGE  
± 20  
V
PD @ TC = 25°C  
Maximum Power Dissipation  
208  
W
PD @ TC = 100°C Maximum Power Dissipation  
83  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
°C  
300 (0.063 in. (1.6mm) from case)  
Thermal Resistance  
Parameter  
Junction-to-Case - IGBT  
Min.  
–––  
–––  
–––  
–––  
–––  
–––  
Typ.  
–––  
Max.  
0.6  
Units  
°C/W  
g
RθJC  
RθJC  
RθCS  
RθJA  
RθJA  
Wt  
Junction-to-Case - Diode  
–––  
2.1  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Junction-to-Ambient (PCB Mount, steady state)‚  
Weight  
0.50  
–––  
–––  
62  
–––  
40  
1.44  
–––  
www.irf.com  
1
6/24/02  

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