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IRGB4062DPBF PDF预览

IRGB4062DPBF

更新时间: 2024-11-01 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管双极型晶体管超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
12页 954K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

IRGB4062DPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:1.23
外壳连接:COLLECTOR最大集电极电流 (IC):48 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
最大降落时间(tf):41 ns门极发射器阈值电压最大值:6.5 V
门极-发射极最大电压:20 VJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):250 W
认证状态:Not Qualified最大上升时间(tr):31 ns
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):164 ns
标称接通时间 (ton):64 nsBase Number Matches:1

IRGB4062DPBF 数据手册

 浏览型号IRGB4062DPBF的Datasheet PDF文件第2页浏览型号IRGB4062DPBF的Datasheet PDF文件第3页浏览型号IRGB4062DPBF的Datasheet PDF文件第4页浏览型号IRGB4062DPBF的Datasheet PDF文件第5页浏览型号IRGB4062DPBF的Datasheet PDF文件第6页浏览型号IRGB4062DPBF的Datasheet PDF文件第7页 
PD - 97190  
IRGB4062DPbF  
IRGP4062DPbF  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
Features  
• Low VCE (ON) Trench IGBT Technology  
• Low switching losses  
C
VCES = 600V  
• Maximum Junction temperature 175 °C  
• 5 µS short circuit SOA  
IC = 24A, TC = 100°C  
• SquareRBSOA  
G
tSC 5µs, TJ(max) = 175°C  
• 100% of the parts tested for 4X rated current (ILM  
• Positive VCE (ON) Temperature co-efficient  
• Ultra fast soft Recovery Co-Pak Diode  
• Tightparameterdistribution  
)
E
VCE(on) typ. = 1.65V  
n-channel  
• LeadFreePackage  
C
C
Benefits  
• High Efficiency in a wide range of applications  
E
C
• Suitable for a wide range of switching frequencies due to  
Low VCE (ON) and Low Switching losses  
• RuggedtransientPerformanceforincreasedreliability  
• ExcellentCurrentsharinginparalleloperation  
• Low EMI  
E
C
G
G
TO-220AB  
TO-247AC  
G
C
E
Gate  
Collector  
Emitter  
Absolute Maximum Ratings  
Parameter  
Max.  
600  
48  
Units  
V
VCES  
Collector-to-Emitter Voltage  
IC @ TC = 25°C  
Continuous Collector Current  
Continuous Collector Current  
Pulse Collector Current  
IC @ TC = 100°C  
24  
ICM  
96  
Clamped Inductive Load Current  
Diode Continous Forward Current  
Diode Continous Forward Current  
Diode Maximum Forward Current  
Continuous Gate-to-Emitter Voltage  
Transient Gate-to-Emitter Voltage  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
ILM  
96  
A
IF @ TC = 25°C  
48  
IF @ TC = 100°C  
24  
IFM  
96  
VGE  
±20  
±30  
250  
125  
V
PD @ TC = 25°C  
W
PD @ TC = 100°C  
TJ  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf·in (1.1 N·m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
–––  
–––  
–––  
Typ.  
–––  
–––  
–––  
–––  
0.50  
80  
Max.  
0.60  
1.53  
0.65  
1.62  
–––  
Units  
RθJC (IGBT)  
RθJC (Diode)  
RθJC (IGBT)  
RθJC (Diode)  
RθCS  
Thermal Resistance Junction-to-Case-(each IGBT) TO-220AB  
Thermal Resistance Junction-to-Case-(each Diode) TO-220AB  
Thermal Resistance Junction-to-Case-(each IGBT) TO-247AC  
Thermal Resistance Junction-to-Case-(each Diode) TO-247AC  
Thermal Resistance, Case-to-Sink (flat, greased surface)  
Thermal Resistance, Junction-to-Ambient (typical socket mount)  
°C/W  
RθJA  
–––  
1
www.irf.com  
02/24/06  

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