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IRF7413PBF PDF预览

IRF7413PBF

更新时间: 2024-11-05 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管局域网
页数 文件大小 规格书
9页 211K
描述
HEXFET Power MOSFET

IRF7413PBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, SOP-8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:6.83
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE
雪崩能效等级(Eas):260 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):12 A
最大漏极电流 (ID):13 A最大漏源导通电阻:0.011 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.5 W
最大脉冲漏极电流 (IDM):58 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7413PBF 数据手册

 浏览型号IRF7413PBF的Datasheet PDF文件第2页浏览型号IRF7413PBF的Datasheet PDF文件第3页浏览型号IRF7413PBF的Datasheet PDF文件第4页浏览型号IRF7413PBF的Datasheet PDF文件第5页浏览型号IRF7413PBF的Datasheet PDF文件第6页浏览型号IRF7413PBF的Datasheet PDF文件第7页 
PD - 95017A  
IRF7413PbF  
HEXFET® Power MOSFET  
l GenerationVTechnology  
l Ultra Low On-Resistance  
l N-ChannelMosfet  
l SurfaceMount  
l AvailableinTape&Reel  
l Dynamicdv/dtRating  
l Fast Switching  
A
A
1
2
3
4
8
7
S
S
S
G
D
VDSS = 30V  
D
6
5
D
D
l 100% RG Tested  
l Lead-Free  
RDS(on) = 0.011Ω  
Top View  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of power  
applications. With these improvements, multiple devices  
can be used in an application with dramatically reduced  
board space. The package is designed for vapor phase,  
infra red, or wave soldering techniques. Power dissipation  
of greater than 0.8W is possible in a typical PCB mount  
application.  
SO-8  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max  
Units  
VDS  
Drain-to-Source Voltage  
30  
± 20  
13  
V
V
Gate-to-Source Voltage  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TA = 25°C  
D
D
@ TA = 70°C  
9.2  
58  
A
DM  
P
@TA = 25°C  
Power Dissipation  
2.5  
W
D
Linear Derating Factor  
Single Pulse Avalanche Energency  
0.02  
260  
mW/°C  
mJ  
E
AS  
dv/dt  
Peak Diode Recovery dv/dt  
5.0  
V/ns  
°C  
J, TSTG  
T
Junction and Storage Temperature Range  
-55 to +150  
Thermal Resistance Ratings  
Symbol  
Parameter  
Typ  
Max  
Units  
Junction-to-Drain Lead  
Rθ  
Rθ  
–––  
20  
JL  
°C/W  
Junction-to-Ambient  
–––  
50  
JA  
06/29/06  

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