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HGT1S10N120BNS PDF预览

HGT1S10N120BNS

更新时间: 2024-11-05 22:20:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管电动机控制瞄准线双极性晶体管
页数 文件大小 规格书
8页 212K
描述
35A, 1200V, NPT Series N-Channel IGBT

HGT1S10N120BNS 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:D2PAK
包装说明:TO-263AB, 3 PIN针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.08
Is Samacsys:N其他特性:LOW CONDUCTION LOSS
外壳连接:COLLECTOR最大集电极电流 (IC):35 A
集电极-发射极最大电压:1200 V配置:SINGLE
最大降落时间(tf):200 ns门极-发射极最大电压:20 V
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):298 W认证状态:Not Qualified
最大上升时间(tr):15 ns子类别:Insulated Gate BIP Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:MOTOR CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):330 ns
标称接通时间 (ton):32 nsBase Number Matches:1

HGT1S10N120BNS 数据手册

 浏览型号HGT1S10N120BNS的Datasheet PDF文件第2页浏览型号HGT1S10N120BNS的Datasheet PDF文件第3页浏览型号HGT1S10N120BNS的Datasheet PDF文件第4页浏览型号HGT1S10N120BNS的Datasheet PDF文件第5页浏览型号HGT1S10N120BNS的Datasheet PDF文件第6页浏览型号HGT1S10N120BNS的Datasheet PDF文件第7页 
HGTG10N120BN, HGTP10N120BN,  
HGT1S10N120BNS  
Data Sheet  
August 2002  
35A, 1200V, NPT Series N-Channel IGBT  
Features  
o
The HGTG10N120BN, HGTP10N120BN and  
• 35A, 1200V, T = 25 C  
C
HGT1S10N120BNS are Non-Punch Through (NPT) IGBT  
designs. They are new members of the MOS gated high  
voltage switching IGBT family. IGBTs combine the best  
features of MOSFETs and bipolar transistors. This device  
has the high input impedance of a MOSFET and the low on-  
state conduction loss of a bipolar transistor.  
• 1200V Switching SOA Capability  
o
Typical Fall Time. . . . . . . . . . . . . . . . 140ns at T = 150 C  
J
• Short Circuit Rating  
• Low Conduction Loss  
• Avalanche Rated  
The IGBT is ideal for many high voltage switching  
applications operating at moderate frequencies where low  
conduction losses are essential, such as: AC and DC motor  
controls, power supplies and drivers for solenoids, relays  
and contactors.  
Thermal Impedance SPICE Model  
Temperature Compensating SABER™ Model  
www.fairchildsemi.com  
• Related Literature  
- TB334 “Guidelines for Soldering Surface Mount  
Components to PC Boards  
Formerly Developmental Type TA49290.  
Ordering Information  
Packaging  
PART NUMBER  
HGTG10N120BN  
HGTP10N120BN  
HGT1S10N120BNS  
PACKAGE  
BRAND  
G10N120BN  
JEDEC STYLE TO-247  
TO-247  
E
C
TO-220AB  
TO-263AB  
10N120BN  
10N120BN  
COLLECTOR  
(FLANGE)  
G
NOTE: When ordering, use the entire part number. Add the suffix T  
to obtain the TO-263AB variant in tape and reel, e.g.  
HGT1S10N120BNST.  
Symbol  
C
JEDEC TO-220AB (ALTERNATE VERSION)  
G
COLLECTOR  
(FLANGE)  
E
C
G
E
JEDEC TO-263AB  
COLLECTOR  
(FLANGE)  
G
E
FAIRCHILD SEMICONDUCTOR IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS  
4,364,073  
4,598,461  
4,682,195  
4,803,533  
4,888,627  
4,417,385  
4,605,948  
4,684,413  
4,809,045  
4,890,143  
4,430,792  
4,620,211  
4,694,313  
4,809,047  
4,901,127  
4,443,931  
4,631,564  
4,717,679  
4,810,665  
4,904,609  
4,466,176  
4,639,754  
4,743,952  
4,823,176  
4,933,740  
4,516,143  
4,639,762  
4,783,690  
4,837,606  
4,963,951  
4,532,534  
4,641,162  
4,794,432  
4,860,080  
4,969,027  
4,587,713  
4,644,637  
4,801,986  
4,883,767  
©2002 Fairchild Semiconductor Corporation  
HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS Rev. B1  

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