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HGT1S12N60B3S PDF预览

HGT1S12N60B3S

更新时间: 2024-01-10 03:31:57
品牌 Logo 应用领域
英特矽尔 - INTERSIL 晶体晶体管电动机控制瞄准线双极性晶体管
页数 文件大小 规格书
7页 116K
描述
27A, 600V, UFS Series N-Channel IGBTs

HGT1S12N60B3S 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
风险等级:5.01其他特性:LOW CONDUCTION LOSS
外壳连接:COLLECTOR最大集电极电流 (IC):27 A
集电极-发射极最大电压:600 V配置:SINGLE
最大降落时间(tf):175 ns门极发射器阈值电压最大值:6 V
门极-发射极最大电压:20 VJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):104 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
晶体管应用:MOTOR CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):392 ns标称接通时间 (ton):45 ns
Base Number Matches:1

HGT1S12N60B3S 数据手册

 浏览型号HGT1S12N60B3S的Datasheet PDF文件第2页浏览型号HGT1S12N60B3S的Datasheet PDF文件第3页浏览型号HGT1S12N60B3S的Datasheet PDF文件第4页浏览型号HGT1S12N60B3S的Datasheet PDF文件第5页浏览型号HGT1S12N60B3S的Datasheet PDF文件第6页浏览型号HGT1S12N60B3S的Datasheet PDF文件第7页 
HGTP12N60B3, HGT1S12N60B3S  
Data Sheet  
January 2000  
File Number 4410.2  
27A, 600V, UFS Series N-Channel IGBTs  
Features  
o
The HGTP12N60B3 and HGT1S12N60B3S are MOS gated  
high voltage switching devices combining the best features  
of MOSFETs and bipolar transistors. These devices have  
the high input impedance of a MOSFET and the low on-state  
conduction loss of a bipolar transistor. The much lower  
• 27A, 600V, T = 25 C  
C
• 600V Switching SOA Capability  
o
Typical Fall Time. . . . . . . . . . . . . . . . 112ns at T = 150 C  
J
• Short Circuit Rating  
• Low Conduction Loss  
• Related Literature  
o
on-state voltage drop varies only moderately between 25 C  
o
and 150 C.  
The IGBT is ideal for many high voltage switching  
applications operating at moderate frequencies where low  
conduction losses are essential, such as: AC and DC motor  
controls, power supplies and drivers for solenoids, relays  
and contactors.  
- TB334 “Guidelines for Soldering Surface Mount  
Components to PC Boards”  
Packaging  
JEDEC TO-220AB  
Formerly developmental type TA49171.  
E
C
G
Ordering Information  
COLLECTOR  
(FLANGE)  
PART NUMBER  
PACKAGE  
TO-220AB  
TO-263AB  
BRAND  
G12N60B3  
G12N60B3  
HGTP12N60B3  
HGT1S12N60B3S  
NOTE: When ordering, use the entire part number. Add the suffix 9A  
to obtain the TO-263AB variant in tape and reel, e.g.,  
HGT1S12N60B3S9A.  
JEDEC TO-263AB  
COLLECTOR  
(FLANGE)  
Symbol  
C
G
E
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS  
4,364,073  
4,598,461  
4,682,195  
4,803,533  
4,888,627  
4,417,385  
4,605,948  
4,684,413  
4,809,045  
4,890,143  
4,430,792  
4,620,211  
4,694,313  
4,809,047  
4,901,127  
4,443,931  
4,631,564  
4,717,679  
4,810,665  
4,904,609  
4,466,176  
4,639,754  
4,743,952  
4,823,176  
4,933,740  
4,516,143  
4,639,762  
4,783,690  
4,837,606  
4,963,951  
4,532,534  
4,641,162  
4,794,432  
4,860,080  
4,969,027  
4,587,713  
4,644,637  
4,801,986  
4,883,767  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000  
1

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