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FGB3040CS_12 PDF预览

FGB3040CS_12

更新时间: 2024-09-20 12:23:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 双极性晶体管
页数 文件大小 规格书
9页 590K
描述
EcoSPARKTM 300mJ, 400V, N-Channel Current Sensing Ignition IGBT

FGB3040CS_12 数据手册

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April 2012  
FGB3040CS  
tm  
TM  
EcoSPARK 300mJ, 400V, N-Channel Current Sensing Ignition IGBT  
General Description  
Applications  
The FGB3040CS is an lgnition IGBT that offers outstand-  
ing SCIS capability along with a ratiometric emitter current  
sensing capability. This sensing is based on a emitter  
active area ratio of 200:1. The output is provided through a  
fourth (sense) lead. This signal provides a current level  
that is proportional to the main collector to emitter current.  
The effective ratio as measured on the sense lead is a  
function of the sense output, the collector current and the  
gate to emitter drive voltage.  
„ Smart Automotive lgnition Coil Driver Circuits  
„ ECU Based Systems  
„ Distributorless Based Systems  
„ Coil on Plug Based Systems  
Features  
„ SCIS Energy = 300mJ at TJ = 25oC  
„ Logic Level Gate Drive  
„ Qualified to AEC Q101  
„ RoHS Compliant  
Package  
Symbol  
Device Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
V
BVCER Collector to Emitter Breakdown Voltage (IC = 2mA)  
430  
24  
BVECS Emitter to Collector Breakdown Voltage (IC = 1mA) (Reverse Battery Condition)  
ESCIS25 Self Clamping Inductive Switching Energy (at starting TJ = 25°C)  
ESCIS150 Self Clamping Inductive Switching Energy (at starting TJ = 150°C)  
V
300  
mJ  
mJ  
A
170  
IC25  
Continuous Collector Current, at VGE = 4.0V, TC = 25°C  
Continuous Collector Current, at VGE = 4.0V, TC = 110°C  
Maximum Continuous Gate to Emitter Voltage  
Power Dissipation, at TC = 25°C  
21  
IC110  
VGEM  
19  
A
±10  
V
150  
W
PD  
Power Dissipation Derating, for TC > 25oC  
1
W/oC  
oC  
oC  
oC  
oC  
kV  
TJ  
Operating Junction Temperature Range  
-40 to 175  
-40 to 175  
300  
TSTG  
TL  
Storage Junction Temperature Range  
Max. Lead Temp. for Soldering (at 1.6mm from case for 10sec)  
Max. Package Temp. for Soldering (Package Body for 10 sec)  
Electrostatic Discharge Voltage, HBM model (100pfd, 1500 ohms)  
TPKG  
ESD  
260  
4
@2012 Fairchild Semiconductor Corporation  
FGB3040CS Rev. C1  
1
www.fairchildsemi.com  

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