DATA SHEET
www.onsemi.com
EcoSPARKꢀ Ignition IGBT
20 mJ, 360 V, N−Channel Ignition IGBT
FGB3236-F085,
FGI3236-F085
2
D PAK−3
I2PAK (TO−262 3 LD)
CASE 418AJ
CASE 418AV
Features
2
• Industry Standard D PAK Package
MARKING DIAGRAM
• SCIS Energy = 330 mJ at T = 25°C
J
1 Gate
2 Collector
3 Emitter
• Logic Level Gate Drive
AYWW
XXX
XXXXXG
• AEC−Q101 Qualified and PPAP Capable
• RoHS Compliant
4 Collector
Applications
A
Y
WW
XXXX
G
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
• Automotive Ignition Coil Driver Circuits
• Coil On Plug Applications
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Collector (Flange)
Symbol
Parameter
Value
Units
BV
Collector to Emitter Breakdown Voltage
C
360
V
CER
(I = 1 mA)
$Y&Z&3&K
FGI
3236
BV
Emitter to Collector Voltage − Reverse
24
320
160
44
V
mJ
mJ
A
ECS
Battery Condition (I = 10 mA)
C
E
Self Clamping Inductive Switching Energy
SCIS25
(I
SCIS
= 14.7 A, L = 3.0 mHy, T = 25°C)
J
Gate
Emitter
= onsemi Logo
= Assembly Plant Code
= Numeric Date Code
= Lot Code
E
Self Clamping Inductive Switching Energy
(I = 10.4 A, L = 3.0 mHy, T = 150°C)
SCIS150
SCIS
J
$Y
&Z
&3
&K
I
Collector Current Continuous
at V = 4.0 V, T = 25°C
C25
GE
C
I
Collector Current Continuous
at V = 4.0 V, T = 110°C
27
A
C110
FGI3236 = Specific Device Code
GE
C
V
Gate to Emitter Voltage Continuous
10
187
V
W
GEM
P
Power Dissipation Total, at T = 25°C
D
C
SYMBOL
Power Dissipation Derating, for T > 25°C
1.25
W/°C
°C
C
COLLECTOR
T
J
Operating Junction Temperature Range
Storage Junction Temperature Range
−40 to +175
−40 to +175
300
T
T
°C
STG
R
1
T
L
Max. Lead Temperature for Soldering
(Leads at 1.6 mm from case for 10 s)
°C
GATE
R
2
Max. Lead Temperature for Soldering
(Package Body for 10 s)
260
4
°C
PKG
ESD
Electrostatic Discharge Voltage
at 100 pF, 1500 W
kV
EMITTER
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information on page 3
of this data sheet.
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
July, 2022 − Rev. 2
FGB3236−F085/D