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FGB30N6S2T PDF预览

FGB30N6S2T

更新时间: 2024-11-08 20:52:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 瞄准线功率控制晶体管
页数 文件大小 规格书
8页 138K
描述
Insulated Gate Bipolar Transistor, 45A I(C), 600V V(BR)CES, N-Channel, TO-263AB, PLASTIC, D2PAK-3

FGB30N6S2T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:PLASTIC, D2PAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.64
其他特性:LOW CONDUCTION LOSS外壳连接:COLLECTOR
最大集电极电流 (IC):45 A集电极-发射极最大电压:600 V
配置:SINGLE最大降落时间(tf):100 ns
门极发射器阈值电压最大值:5 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):167 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):163 ns标称接通时间 (ton):28 ns
Base Number Matches:1

FGB30N6S2T 数据手册

 浏览型号FGB30N6S2T的Datasheet PDF文件第2页浏览型号FGB30N6S2T的Datasheet PDF文件第3页浏览型号FGB30N6S2T的Datasheet PDF文件第4页浏览型号FGB30N6S2T的Datasheet PDF文件第5页浏览型号FGB30N6S2T的Datasheet PDF文件第6页浏览型号FGB30N6S2T的Datasheet PDF文件第7页 
August 2003  
FGH30N6S2 / FGP30N6S2 / FGB30N6S2  
600V, SMPS II Series N-Channel IGBT  
General Description  
Features  
The FGH30N6S2, FGP30N6S2, and FGB30N6S2 are Low  
Gate Charge, Low Plateau Voltage SMPS II IGBTs combin-  
ing the fast switching speed of the SMPS IGBTs along with  
lower gate charge and plateau voltage and avalanche capa-  
bility (UIS). These LGC devices shorten delay times, and  
reduce the power requirement of the gate drive. These de-  
vices are ideally suited for high voltage switched mode pow-  
er supply applications where low conduction loss, fast  
switching times and UIS capability are essential. SMPS II  
LGC devices have been specially designed for:  
• 100kHz Operation at 390V, 14A  
• 200kHZ Operation at 390V, 9A  
• 600V Switching SOA Capability  
o
Typical Fall Time. . . . . . . . . . . 90ns at TJ = 125 C  
• Low Gate Charge . . . . . . . . . 23nC at V = 15V  
GE  
• Low Plateau Voltage . . . . . . . . . . . . .6.5V Typical  
• UIS Rated . . . . . . . . . . . . . . . . . . . . . . . . . 150mJ  
• Low Conduction Loss  
Power Factor Correction (PFC) circuits  
Full bridge topologies  
Half bridge topologies  
Push-Pull circuits  
Uninterruptible power supplies  
Zero voltage and zero current switching circuits  
Formerly Developmental Type TA49367.  
Symbol  
Package  
C
TO-247  
E
C
E
TO-220AB  
C
G
G
TO-263AB  
G
G
E
E
COLLECTOR  
(Back-Metal)  
COLLECTOR  
(Flange)  
Device Maximum Ratings T = 25°C unless otherwise noted  
C
Symbol  
BV  
Parameter  
Collector to Emitter Breakdown Voltage  
Collector Current Continuous, T = 25°C  
Ratings  
Units  
600  
45  
V
A
A
A
V
V
CES  
I
C25  
C
I
Collector Current Continuous, T = 110°C  
20  
C110  
C
I
Collector Current Pulsed (Note 1)  
Gate to Emitter Voltage Continuous  
Gate to Emitter Voltage Pulsed  
108  
CM  
V
±20  
GES  
GEM  
V
±30  
SSOA  
Switching Safe Operating Area at T = 150°C, Figure 2  
60A at 600V  
150  
J
E
Pulsed Avalanche Energy, I = 20A, L = 1.3mH, V = 50V  
mJ  
W
AS  
CE  
DD  
P
Power Dissipation Total T = 25°C  
167  
D
C
Power Dissipation Derating T > 25°C  
1.33  
W/°C  
°C  
C
T
Operating Junction Temperature Range  
Storage Junction Temperature Range  
-55 to 150  
-55 to 150  
J
T
°C  
STG  
CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and  
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. Pulse width limited by maximum junction temperature.  
©2003 Fairchild Semiconductor Corporation  
FGH30N6S2 / FGP30N6S2 / FGB30N6S2 Rev. A1  

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