DATA SHEET
www.onsemi.com
MOSFET – P-Channel,
POWERTRENCH)
S
D
D
G
D
D
2.5 V Specified
TSOT−23−6
CASE 419BL
FDC608PZ, FDC608PZ-F171
Description
1
2
3
6
5
4
This P−Channel 2.5 V specified MOSFET is produced using
onsemi’s advanced POWERTRENCH process that has been
especially tailored to minimize the on−state resistance and yet
maintain low gate charge for superior switching performance. These
devices are well suited for battery power applications: load switching
and power management, battery power circuits, and dc−dc
conversions.
Features
MARKING DIAGRAM
• –5.8 A, –20 V. R
= 30 mW @ V = –4.5 V
GS
= 43 mW @ V = –2.5 V
GS
DS(ON)
R
DS(ON)
608Z MG
• Low Gate Charge
G
• High Performance Trench Technology for Extremely Low R
DS(ON)
1
TM
• SuperSOT
–6 Package: Small Footprint (72% Smaller than
Standard SO–8) Low Profile (1 mm Thick)
608Z
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
• These Devices are Pb−Free and Halide Free
(Note: Microdot may be in either location)
ABSOLUTE MAXIMUM RATINGS
Values are at T = 25°C unless otherwise noted.
A
ORDERING INFORMATION
Symbol
Parameter
Drain−Gate Voltage
Gate−Source Voltage
Drain Current – Continuous (Note 1a)
Ratings
–20
Unit
V
V
V
A
DSS
GSS
†
Package
Device
Shipping
V
12
TSOT−23−6
(Pb-Free/
3000 /
Tape & Reel
FDC608PZ
I
D
–5.8
–20
Halide Free)
– Pulsed
P
D
Maximum Power Dissipation (Note 1a)
(Note 1b)
1.6
0.8
W
TSOT−23−6
(Pb-Free/
3000 /
Tape & Reel
FDC608PZ−F171
Halide Free)
T , T
Operating and Storage Junction
Temperature Range
–55 to +150
°C
J
STG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Values are at T = 25°C unless otherwise noted.
A
Symbol
Parameter
Value
Unit
R
Thermal Resistance, Junction−to−Ambient
(Note 1a)
78
°C/W
q
JA
R
Thermal Resistance, Junction−to−Case
(Note 1)
30
°C/W
q
JC
1
Publication Order Number:
© Semiconductor Components Industries, LLC, 1997
FDC608PZ/D
March 2022 − Rev. 3