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AUIRFU3607 PDF预览

AUIRFU3607

更新时间: 2024-11-21 12:53:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 248K
描述
Advanced Process Technology

AUIRFU3607 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:IPAK-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.73
其他特性:HIGH RELIABILITY, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):120 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (Abs) (ID):80 A
最大漏极电流 (ID):56 A最大漏源导通电阻:0.009 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-251AA
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):140 W最大脉冲漏极电流 (IDM):310 A
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRFU3607 数据手册

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PD - 96376  
AUIRFR3607  
AUIRFU3607  
AUTOMOTIVE GRADE  
Features  
l
l
l
l
l
l
l
Advanced Process Technology  
HEXFET® Power MOSFET  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
D
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
75V  
7.34m  
Ω
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
9.0m  
Ω
G
80A  
S
56A  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniquestoachieveextremelylowon-resistancepersilicon  
area. Additional features of this design are a 175°C junction  
operating temperature, fast switching speed and improved  
repetitive avalanche rating . These features combine to make  
thisdesignanextremelyefficientandreliabledeviceforusein  
Automotiveapplicationsandawidevarietyofotherapplications.  
D
S
S
D
G
G
I-Pak  
AUIRFU3607  
D-Pak  
AUIRFR3607  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are  
stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the  
specificationsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.  
The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient  
temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
80  
56  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
A
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
56  
310  
PD @TC = 25°C  
W
140  
Maximum Power Dissipation  
0.96  
± 20  
120  
Linear Derating Factor  
W/°C  
V
VGS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
mJ  
A
Avalanche Current  
IAR  
46  
Repetitive Avalanche Energy  
EAR  
mJ  
14  
27  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
300(1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
Max.  
1.045  
50  
Units  
Rθ  
–––  
–––  
–––  
Junction-to-Case  
Junction-to-Ambient  
Junction-to-Ambient (PCB Mount)  
JC  
Rθ  
°C/W  
JA  
RθJA  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/22/11  

AUIRFU3607 替代型号

型号 品牌 替代类型 描述 数据表
AUIRFR3607 INFINEON

完全替代

Advanced Process Technology
IRFSL3607PBF INFINEON

完全替代

HEXFET Power MOSFET
IRFB3607PBF INFINEON

完全替代

HEXFET Power MOSFET

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