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AUIRFZ24NSTRR PDF预览

AUIRFZ24NSTRR

更新时间: 2024-01-27 08:50:30
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 235K
描述
Advanced Planar Technology Low On-Resistance

AUIRFZ24NSTRR 数据手册

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PD - 96377  
AUTOMOTIVE GRADE  
AUIRFZ24NS  
AUIRFZ24NL  
Features  
AdvancedPlanarTechnology  
LowOn-Resistance  
Dynamic dV/dT Rating  
175°COperatingTemperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
HEXFET® Power MOSFET  
D
S
V(BR)DSS  
55V  
0.07  
RDS(on) max.  
ID  
Ω
G
17A  
Automotive Qualified *  
D
D
Description  
Specifically designed for Automotive applications, this  
Cellular design of HEXFET® Power MOSFETs utilizes  
the latest processing techniques to achieve low on-  
resistancepersiliconarea.Thisbenefitcombinedwiththe  
fast switching speed and ruggedized device design that  
HEXFET power MOSFETs are well known for, provides  
the designer with an extremely efficient and reliable  
device for use in Automotive and a wide variety of other  
applications.  
S
D
S
D
G
G
D2Pak  
TO-262  
AUIRFZ24NS AUIRFZ24NL  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated  
in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect  
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still  
air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
17  
Units  
I
I
I
@ T = 25°C  
C
D
D
12  
@ T = 100°C  
A
C
68  
DM  
3.8  
P
P
@T = 25°C  
Power Dissipation  
D
D
A
W
45  
Power Dissipation  
@T = 25°C  
C
0.3  
Linear Derating Factor  
W/°C  
V
± 20  
V
Gate-to-Source Voltage  
GS  
EAS  
IAR  
71  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
10  
4.5  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
6.8  
V/ns  
-55 to + 175  
T
T
J
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
STG  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
Max.  
3.3  
Units  
RθJC  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mounted, steady-state)  
40  
°C/W  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/22/11  

AUIRFZ24NSTRR 替代型号

型号 品牌 替代类型 描述 数据表
AUIRFZ24NSTRL INFINEON

类似代替

Advanced Planar Technology Low On-Resistance
AUIRFZ24NS INFINEON

类似代替

Advanced Planar Technology Low On-Resistance
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