New Product
SiZ704DT
Vishay Siliconix
N-Channel 30-V (D-S) MOSFETs
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
VDS (V)
RDS(on) (Ω)
ID (A) Qg (Typ.)
Definition
12a
12a
TrenchFET® Power MOSFETs
100 % Rg Tested
100 % UIS Tested
0.024 at VGS = 10 V
0.030 at VGS = 4.5 V
0.0135 at VGS = 10 V
0.017 at VGS = 4.5 V
•
•
•
Channel-1
Channel-2
30
3.8 nC
16a
16a
30
7.3 nC
• Compliant to RoHS Directive 2002/95/EC
V
/D
IN 1
APPLICATIONS
•
•
Notebook System Power
POL
PowerPAIR™ 6 x 3.7
3.73 mm
•
Low Current DC/DC
G1
2
GHS
2
Pin 1
G /G
HS 1
1
1
VIN
D1
3
D1
VIN
N-Channel 1
MOSFET
D1
VIN
V
/S /D
1 2
3
SW
S1/D2
S2
G2
VSW
GLS
GND
S2
6
6
G
/G
2
6.00 mm
LS
GND
5
5
N-Channel 2
MOSFET
4
4
GND/S
Ordering Information: SiZ704DT-T1-GE3 (Lead (Pb)-free and Halogen-free)
2
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Channel-1
Channel-2
Unit
VDS
30
30
Drain-Source Voltage
Gate-Source Voltage
V
VGS
20
12a
12a
9.4b, c
7.5b, c
30
12a
3.1b, c
16a
16a
14b, c
11.2b, c
40
16a
3.7b, c
15
T
C = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
Continuous Drain Current (TJ = 150 °C)
A
IDM
IS
Pulsed Drain Current
TC = 25 °C
TA = 25 °C
Source Drain Current Diode Current
IAS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
10
L = 0.1 mH
EAS
5
11
mJ
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
20
30
12.9
19
PD
Maximum Power Dissipation
W
3.7b, c
2.4b, c
4.5b, c
2.9b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Channel-1
Typ. Max.
26 34
4.7 6.2
Channel-2
Typ. Max.
21 28
3.2 4.2
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
Unit
t ≤ 10 s
°C/W
RthJC
Steady State
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 72 °C/W for Channel-1 and 67 °C/W for Channel-2.
Document Number: 65367
S09-1921-Rev. A, 28-Sep-09
www.vishay.com
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