New Product
SiZ790DT
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFETs with Schottky Diode
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
Definition
VDS (V)
RDS(on) (Ω)
ID (A) Qg (Typ.)
16a
16a
SkyFET® Monolithic TrenchFET®
Power MOSFETs and Schottky Diode
100 % Rg Tested
0.0093 at VGS = 10 V
0.0130 at VGS = 4.5 V
0.0047 at VGS = 10 V
0.0059 at VGS = 4.5 V
•
Channel-1
Channel-2
30
7.7 nC
•
•
35a
35a
100 % UIS Tested
30
17 nC
• Compliant to RoHS Directive 2002/95/EC
V
/D
IN 1
APPLICATIONS
PowerPAIR® 6 x 3.7
•
System Power
- Notebook
- Server
G
G
/
HS
G1
2
3.73 mm
D1
Pin 1
GHS
1
1
D1
3
•
•
POL
1
VIN
2
VIN
N-Channel 1
MOSFET
VIN
Synchronous Buck
Converter
V
S /D
/
SW
D1
3
1
2
S1/D2
S2
G2
Schottky
Diode
VSW
G
G
/
GLS
GND
LS
S2
6
6.00 mm
2
6
5
GND
N-Channel 2
MOSFET
5
4
4
Ordering Information: SiZ790DT-T1-GE3 (Lead (Pb)-free and Halogen-free)
GND/S
2
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)
A
Parameter
Symbol
Channel-1
Channel-2
Unit
VDS
30
20
Drain-Source Voltage
Gate-Source Voltage
V
VGS
16a
16a
12.9b, c
10.3b, c
70
16a
3.2b, c
35a
35a
23.4b, c
18.7b, c
100
35a
3.8b, c
30
T
C = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
Continuous Drain Current (TJ = 150 °C)
A
IDM
IS
Pulsed Drain Current (t = 300 µs)
TC = 25 °C
TA = 25 °C
Continuous Source Drain Diode Current
IAS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
16
L = 0.1 mH
EAS
13
45
mJ
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
27
48
17
31
PD
Maximum Power Dissipation
W
3.9b, c
2.5b, c
4.6b, c
3b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Channel-1
Typ. Max.
Channel-2
Typ. Max.
27
2.6
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
Unit
t ≤ 10 s
Steady State
24
32
20
2
°C/W
RthJC
3.5
4.6
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 67 °C/W for channel-1 and 65 °C/W for channel-2.
Document Number: 67669
S11-0607-Rev. A, 04-Apr-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000