SiZF906DDT
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFET with Schottky Diode
FEATURES
• TrenchFET® Gen IV power MOSFET
• SkyFET® low side MOSFET with integrated
Schottky
• 100 % Rg and UIS tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
VIN/D1
APPLICATIONS
N-Channel 1
MOSFET
• CPU core power
PRODUCT SUMMARY
GHS/G1
• Computer / server peripherals
• POL
CHANNEL-1 CHANNEL-2
G1Return/S1
VSW/S1-D2
V
DS (V)
30
0.00210
0.0044
11
30
0.00090
0.00130
38
• Synchronous buck converter
• Telecom DC/DC
R
DS(on) max. () at VGS = 10 V
R
DS(on) max. () at VGS = 4.5 V
Schottky
Diode
GLS/G2
Qg typ. (nC)
D (A) a
Configuration
I
105
257
N-Channel 2
MOSFET
Dual
GND/S2
ORDERING INFORMATION
Package
PowerPAIR 6 x 5F
Lead (Pb)-free and halogen-free
SiZF906DDT-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
CHANNEL-1
CHANNEL-2
30
+20, -16
257
UNIT
VDS
VGS
30
+20, -16
105
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
84
206
Continuous drain current (TJ = 150 °C)
ID
36 b, c
29 b, c
150
63 b, c
50 b, c
350
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
34
4.1 b, c
23
26.5
38
24
4.5 b, c
2.9 b, c
141 a
8.5 b, c
40
80
83
53
5 b, c
3.2 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
MAX.
TYP.
MAX.
25
Maximum junction-to-ambient b, f
Maximum junction-to-case (source)
t 10 s
Steady state
RthJA
RthJC
22
28
20
°C/W
2.6
3.3
1.2
1.5
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 60 °C/W for channel-1 and 60 °C/W for channel-2
S24-0399-Rev. A, 22-Apr-2024
Document Number: 61545
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000