SiZF918BDT
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFET With Schottky Diode
FEATURES
• TrenchFET® Gen IV power MOSFET
• SkyFET® low side MOSFET with integrated
Schottky
• 100 % Rg and UIS tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
VIN/D1
APPLICATIONS
• CPU core power
N-Channel 1
MOSFET
• Computer / server peripherals GHS/G1
PRODUCT SUMMARY
• POL
G1Return/S1
GLS/G2
VSW/S1-D2
CHANNEL-1 CHANNEL-2
• Synchronous buck converter
• Telecom DC/DC
VDS (V)
30
0.0033
0.0053
9
30
0.0014
0.0023
24
RDS(on) max. (Ω) at VGS = 10 V
RDS(on) max. (Ω) at VGS = 4.5 V
Qg typ. (nC)
ID (A) a
Configuration
Schottky
Diode
73
158
N-Channel 2
MOSFET
Dual
GND/S2
ORDERING INFORMATION
Package
PowerPAIR® 6 x 5F
SiZF918BDT-T1-GE3
Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
CHANNEL-1
CHANNEL-2
30
+16, -12
158
UNIT
VDS
VGS
30
+20, -16
73
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
59
127
Continuous drain current (TJ = 150 °C)
ID
25 b, c
20 b, c
210
41 b, c
33 b, c
280
A
Pulsed drain current (t = 100 μs)
IDM
IS
T
C = 25 °C
24
3.1 b, c
20
20
26.6
17
3.4 b, c
2.2 b, c
54
3.7 b, c
26
34
60
38
4 b, c
2.6 b, c
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
mJ
W
T
C = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
MAX.
TYP.
25
MAX.
31
Maximum junction-to-ambient b, f
Maximum junction-to-case (source)
t ≤ 10 s
Steady state
RthJA
RthJC
30
37
°C/W
3.8
4.7
1.7
2.1
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR 6 x 5F is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 77 °C/W for channel-1 and 68 °C/W for channel-2
S23-1189-Rev. A, 25-Dec-2023
Document Number: 62448
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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