SiZ998DT
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFETs
FEATURES
• TrenchFET® Gen IV power MOSFETs
• SkyFET® low side MOSFET with integrated
Schottky
PowerPAIR® 6 x 5
G2
8
S2
7
S2
6
S2
5
S1/D2
(Pin 9)
• 100 % Rg and UIS tested
D1
1
G1
2
D1
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
3
D1
4
D1
Top View
Bottom View
D
1
APPLICATIONS
• CPU core power
PRODUCT SUMMARY
CHANNEL-1
30
CHANNEL-2
30
G
1
• Computer / server peripherals
• POL
VDS (V)
N-Channel 1
MOSFET
RDS(on) max. () at VGS = 10 V
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
0.0067
0.0100
5.4
0.0028
0.0038
13.2
S /D
1
2
• Synchronous buck converter
• Telecom DC/DC
Schottky
Diode
G
2
ID (A) a, g
20
60
N-Channel 2
MOSFET
Dual plus integrated Schottky
(SkyFET)
Configuration
S
2
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAIR 6 x 5
SiZ998DT-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
30
+20, -16
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
20 a
20 a
60 a
60 a
32.8 b, c
26.2 b, c
130
27.4
4 b, c
20
20
32.9
21.1
4.8 b, c
3.1 b, c
Continuous drain current (TJ = 150 °C)
ID
18.8 b, c
15 c
A
Pulsed drain current (t = 100 μs)
IDM
IS
90
16.8
3.2 b, c
15
11.25
20.2
12.9
3.8 b, c
2.4 b, c
T
C = 25 °C
Continuous source drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
26
MAX.
33
TYP.
21
MAX.
26
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
t 10 s
Steady state
RthJA
RthJC
°C/W
4.7
6.2
3
3.8
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 68 °C/W for channel-1 and 61 °C/W for channel-2
g. TC = 25 °C
S16-0001-Rev. B, 11-Jan-16
Document Number: 62979
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000