Datasheet > SIZ920DT

SIZ920DT

更新时间： 2024-11-15 12:22:35

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威世 - VISHAY		/
页数	文件大小	规格书
14页	212K
描述
Dual N-Channel 30 V (D-S) MOSFETs

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New Product

SiZ920DT

Vishay Siliconix

Dual N-Channel 30 V (D-S) MOSFETs

FEATURES

PRODUCT SUMMARY

•

TrenchFET^®Power MOSFETs

100 % R_gand UIS Tested

Material categorization:

V_DS(V)

R_DS(on)() (Max.)

I_D(A) Q_g(Typ.)

40^a

0.0071 at V_GS= 10 V

0.0089 at V_GS= 4.5 V

0.0030 at V_GS= 10 V

0.0035 at V_GS= 4.5 V

Channel-1

Channel-2

10.5 nC

For definitions of compliance please see

www.vishay.com/doc?99912

40^a

29 nC

APPLICATIONS

•

CPU Core Power

Computer Peripherals

POL

PowerPAIR^®6 x 5

Pin 1

5 mm

Synchronous Buck Converter

N-Channel 1

MOSFET

S /D

Pin 9

6 mm

N-Channel 2

MOSFET

Ordering Information:

SiZ920DT-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Channel-1

Channel-2

Unit

V_DS

V_GS

Drain-Source Voltage

Gate-Source Voltage

40^a

22^{b, c}

17^{b, c}

28^a

3.6^{b, c}

40^a

32^{b, c}

26^{b, c}

120

28^a

4.3^{b, c}

_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

I_D

Continuous Drain Current (T_J= 150 °C)

I_DM

I_S

Pulsed Drain Current (t = 300 µs)

T_C= 25 °C

T_A= 25 °C

Continuous Source Drain Diode Current

I_AS

E_AS

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

100

P_D

Maximum Power Dissipation

4.3^{b, c}

2.8^{b, c}

5.2^{b, c}

3.3^{b, c}

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Channel-1

Typ. Max.

Channel-2

Typ. Max.

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

R_thJC

Unit

t  10 s

°C/W

Steady State

2.5

3.2

1.25

Notes:

a. Package limited - T_C= 25 °C.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not

plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required

to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 65 °C/W for channel-1 and 55 °C/W for channel-2.

Document Number: 63916

S12-0975-Rev. A, 30-Apr-12

For technical questions, contact: pmostechsupport@vishay.com

This document is subject to change without notice.

www.vishay.com

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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