SiZ998BDT
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFET With Schottky Diode
FEATURES
PowerPAIR® 6 x 5
G2
8
• TrenchFET® Gen IV power MOSFET
S2
7
S2
6
• SkyFET® low side MOSFET with integrated
Schottky
S2
5
S1/D2
(Pin 9)
• Very low RDS x Qg FOM improves efficiency
D1
1
G1
• 100 % Rg and UIS tested
2
D1
3
D1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
4
D1
Top View
Bottom View
D1
APPLICATIONS
PRODUCT SUMMARY
• CPU core power
CHANNEL-1 CHANNEL-2
• Computer / server peripherals
G1
VDS (V)
30
0.00439
0.00712
5.7
30
• POL
N-Channel 1
MOSFET
S1/D2
R
DS(on) max. (Ω) at VGS = 10 V
DS(on) max. (Ω) at VGS = 4.5 V
0.0024
0.0038
14.6
• Synchronous buck converter
R
• Telecom DC/DC
Qg typ. (nC)
D (A) a
Schottky
Diode
G2
I
54.8
94.6
Dual plus integrated Schottky
(SkyFET)
N-Channel 2
MOSFET
Configuration
S2
ORDERING INFORMATION
Package
PowerPAIR 6 x 5
Lead (Pb)-free and halogen-free
SiZ998BDT-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
30
+20, -16
94.6
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
30
+20, -16
54.8
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
43.8
75.7
Continuous drain current (TJ = 150 °C)
ID
23.7 b, c
19 b, c
90
36.2 b, c
28.9 b, c
130
A
Pulsed drain current (t = 100 μs)
IDM
IS
T
C = 25 °C
16.7
3.2 b, c
15
11.2
20
12.9
3.8 b, c
2.4 b, c
27.4
4 b, c
20
20
32.9
21.1
4.8 b, c
3.1 b, c
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
mJ
W
T
C = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c, d
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
MAX.
TYP.
21
3
MAX.
26
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
t ≤ 10 s
Steady state
RthJA
RthJC
26
33
°C/W
4.7
6.2
3.8
Notes
a. TC = 25°C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 68 °C/W for channel-1 and 57 °C/W for channel-2
S20-0061-Rev. A, 10-Feb-2020
Document Number: 77875
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000