SiZ988DT
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFETs
FEATURES
• TrenchFET® Gen IV power MOSFETs
PRODUCT SUMMARY
VDS (V)
RDS(on) () (MAX.)
ID (A) Qg (TYP.)
• 100 % Rg and UIS tested
0.0075 at VGS = 10 V
0.0120 at VGS = 4.5 V
0.0041 at VGS = 10 V
0.0052 at VGS = 4.5 V
40 g
Channel-1
Channel-2
30
6.9 nC
32 g
• Optimized Qgs/Qgs ratio improves switching
characteristics
60
30
15.4 nC
60
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
PowerPAIR® 6 x 5
G2
8
S2
7
S2
6
D
S2
APPLICATIONS
1
5
S1/D2
(Pin 9)
• CPU core power
• Computer / server peripherals
G
1
D1
1
G1
• POL
N-Channel 1
MOSFET
2
D1
S /D
1
2
3
D1
• Synchronous buck converter
• Telecom DC/DC
4
D1
Top View
Bottom View
G
2
Ordering Information:
SiZ988DT-T1-GE3 (lead (Pb)-free and halogen-free)
N-Channel 2
MOSFET
S
2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
30
V
VGS
+20, -16
T
C = 25 °C
40 g
32 g
17.5 b, c
14 b, c
70
60 a
60 a
27 b, c
21.7 b, c
140
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
ID
A
Pulsed Drain Current (t = 100 μs)
IDM
IS
T
C = 25 °C
16.8
3.2 b, c
33.6
4 b, c
20
Continuous Source Drain Diode Current
TA = 25 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
IAS
10
L = 0.1 mH
EAS
5
20
mJ
W
T
C = 25 °C
20.2
40
TC = 70 °C
TA = 25 °C
TA = 70 °C
12.9
3.8 b, c
2.4 b, c
25.8
4.8 b, c
3.1 b, c
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
26
MAX.
33
TYP.
21
MAX.
26
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t 10 s
RthJA
RthJC
°C/W
Steady State
4.7
6.2
2.5
3.1
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 68 °C/W for channel-1 and 57 °C/W for channel-2.
g. TC = 25 °C.
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000