New Product
SiZ900DT
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFETs
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
Definition
VDS (V)
RDS(on) ()
ID (A) Qg (Typ.)
•
•
TrenchFET® Power MOSFETs
100 % Rg and UIS Tested
24a
24a
0.0072 at VGS = 10 V
0.0092 at VGS = 4.5 V
0.0039 at VGS = 10 V
0.0047 at VGS = 4.5 V
Channel-1
Channel-2
30
13.5 nC
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
28a
28a
30
34 nC
•
•
•
Notebook System Power
POL
Synchronous Buck Converter
D
1
PowerPAIR® 6 x 5
PIN1
G
1
5 mm
D
1
1
G
1
D
1
2
D
1
N-Channel 1
MOSFET
D
1
3
S /D
1
2
4
G
2
S /D
1
2
S
2
8
S
2
7
G
2
6 mm
S
2
6
5
N-Channel 2
MOSFET
S
2
Ordering Information: SiZ900DT-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)
A
Parameter
Symbol
Channel-1
Channel-2
Unit
VDS
30
20
Drain-Source Voltage
Gate-Source Voltage
V
VGS
24a
24a
19b, c
15.5b, c
90
24a
3.8b, c
28a
28a
28b, c
22b, c
110
28a
4.3b, c
35
T
C = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
Continuous Drain Current (TJ = 150 °C)
A
IDM
IS
Pulsed Drain Current
TC = 25 °C
TA = 25 °C
Continuous Source Drain Diode Current
IAS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
20
L = 0.1 mH
EAS
20
61
mJ
W
T
T
T
C = 25 °C
C = 70 °C
A = 25 °C
48
100
64
5.2b, c
3.3b, c
31
PD
Maximum Power Dissipation
4.6b, c
3b, c
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Channel-1
Typ. Max.
Channel-2
Typ. Max.
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
Unit
t 10 s
22
27
19
1
24
°C/W
RthJC
Steady State
2.1
2.6
1.25
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 62 °C/W for channel-1 and 55 °C/W for channel-2.
Document Number: 67344
S11-1652-Rev. B, 15-Aug-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000