Datasheet > SIZ916DT

SIZ916DT

更新时间： 2024-11-15 12:22:35

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
14页	214K
描述
Dual N-Channel 30 V (D-S) MOSFETs

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SIZ916DT 数据手册

New Product

SiZ916DT

Vishay Siliconix

Dual N-Channel 30 V (D-S) MOSFETs

FEATURES

TrenchFET^®Gen IV Power MOSFETs

PRODUCT SUMMARY

•

V_DS(V)

R_DS(on)() (Max.)

0.0064 at V_GS= 10 V

0.0100 at V_GS= 4.5 V

0.0013 at V_GS= 10 V

0.00175 at V_GS= 4.5 V

Q_g(Typ.)

_D(A)^g

100 % R_gand UIS Tested

Material categorization:

16^a

40^a

Channel-1

Channel-2

7.2 nC

For definitions of compliance please see

www.vishay.com/doc?99912

45 nC

APPLICATIONS

•

CPU Core Power

PowerPAIR^®6 x 5

Computer/Server Peripherals

Synchronous Buck Converter

POL

Pin 1

5 mm

N-Channel 1

MOSFET

Telecom DC/DC

S /D

Pin 9

N-Channel 2

MOSFET

6 mm

Ordering Information:

SiZ916DT-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Channel-1

Channel-2

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

20, - 16

V_GS

T_C= 25 °C

_C= 70 °C

16^a

16^{a, b, c}

15.5^{b, c}

40^a

40^{a, b, c}

38.8^{b, c}

100

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

Pulsed Drain Current (t = 300 µs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

Continuous Source Drain Diode Current

3.25^{b, c}

4.3^{b, c}

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

I_AS

L = 0.1 mH

E_AS

11.25

100

T_C= 25 °C

22.7

14.5

3.9^{b, c}

2.5^{b, c}

_C= 70 °C

_A= 25 °C

Maximum Power Dissipation

P_D

5.2^{b, c}

3.3^{b, c}

T_A= 70 °C

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

T_J, T_stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Channel-1

Typ. Max.

25 32

4.4 5.5

Channel-2

Typ. Max.

19 24

1.25

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

Unit

t  10 s

Steady State

°C/W

R_thJC

Notes:

a. Package limited

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not

plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required

to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 62 °C/W for channel-1 and 55 °C/W for channel-2.

g. T_C= 25 °C.

Document Number: 62721

www.vishay.com

For technical questions, contact: pmostechsupport@vishay.com

This document is subject to change without notice.

S12-2049-Rev. A, 27-Aug-12

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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与SIZ916DT相关器件

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