SiZ916DT
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFETs
FEATURES
• TrenchFET® Gen IV power MOSFETs
PRODUCT SUMMARY
VDS (V)
RDS(on) () (MAX.)
ID (A) g Qg (TYP.)
• 100 % Rg and UIS tested
0.00640 at VGS = 10 V
0.01000 at VGS = 4.5 V
0.00130 at VGS = 10 V
0.00175 at VGS = 4.5 V
16 a
16 a
Channel-1
Channel-2
30
7.2 nC
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
40 a
30
45 nC
40 a
PowerPAIR® 6 x 5
D
1
APPLICATIONS
G2
8
S2
7
• CPU core power
S2
6
S2
• Computer/server peripherals
5
S1/D2
(Pin 9)
G
1
• Synchronous buck converter
• POL
N-Channel 1
MOSFET
D1
1
G1
S /D
1
2
2
D1
3
D1
• Telecom DC/DC
4
D1
G
2
Top View
Bottom View
N-Channel 2
MOSFET
Ordering Information:
SiZ916DT-T1-GE3 (lead (Pb)-free and halogen-free)
S
2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
30
V
VGS
+20, -16
T
T
C = 25 °C
C = 70 °C
16 a
16 a
16 a, b, c
15.5 b, c
80
40 a
40 a
40 a, b, c
38.8 b, c
100
Continuous Drain Current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
A
Pulsed Drain Current (t = 300 μs)
IDM
IS
T
C = 25 °C
19
3.25 b, c
28
4.3 b, c
Continuous Source Drain Diode Current
TA = 25 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
IAS
10
15
L = 0.1 mH
EAS
5
11.25
100
mJ
W
T
T
C = 25 °C
C = 70 °C
22.7
14.5
64
Maximum Power Dissipation
PD
TA = 25 °C
TA = 70 °C
3.9 b, c
2.5 b, c
5.2 b, c
3.3 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
TJ, Tstg
-55 to 150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
25
MAX.
32
TYP.
19
MAX.
24
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t 10 s
RthJA
RthJC
°C/W
Steady State
4.4
5.5
1
1.25
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 62 °C/W for channel-1 and 55 °C/W for channel-2.
g. TC = 25 °C.
S15-1672-Rev. B, 20-Jul-15
Document Number: 62721
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000