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SIZ900DT-T1-GE3 PDF预览

SIZ900DT-T1-GE3

更新时间: 2024-09-30 09:25:03
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
14页 246K
描述
Dual N-Channel 30 V (D-S) MOSFETs

SIZ900DT-T1-GE3 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-C8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:8.43
Is Samacsys:N雪崩能效等级(Eas):20 mJ
外壳连接:DRAIN SOURCE配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):28 A
最大漏极电流 (ID):24 A最大漏源导通电阻:0.0072 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-C8
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
最大脉冲漏极电流 (IDM):90 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIZ900DT-T1-GE3 数据手册

 浏览型号SIZ900DT-T1-GE3的Datasheet PDF文件第2页浏览型号SIZ900DT-T1-GE3的Datasheet PDF文件第3页浏览型号SIZ900DT-T1-GE3的Datasheet PDF文件第4页浏览型号SIZ900DT-T1-GE3的Datasheet PDF文件第5页浏览型号SIZ900DT-T1-GE3的Datasheet PDF文件第6页浏览型号SIZ900DT-T1-GE3的Datasheet PDF文件第7页 
New Product  
SiZ900DT  
Vishay Siliconix  
Dual N-Channel 30 V (D-S) MOSFETs  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
Definition  
VDS (V)  
RDS(on) ()  
ID (A) Qg (Typ.)  
TrenchFET® Power MOSFETs  
100 % Rg and UIS Tested  
24a  
24a  
0.0072 at VGS = 10 V  
0.0092 at VGS = 4.5 V  
0.0039 at VGS = 10 V  
0.0047 at VGS = 4.5 V  
Channel-1  
Channel-2  
30  
13.5 nC  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
28a  
28a  
30  
34 nC  
Notebook System Power  
POL  
Synchronous Buck Converter  
D
1
PowerPAIR® 6 x 5  
PIN1  
G
1
5 mm  
D
1
1
G
1
D
1
2
D
1
N-Channel 1  
MOSFET  
D
1
3
S /D  
1
2
4
G
2
S /D  
1
2
S
2
8
S
2
7
G
2
6 mm  
S
2
6
5
N-Channel 2  
MOSFET  
S
2
Ordering Information: SiZ900DT-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Channel-1  
Channel-2  
Unit  
VDS  
30  
20  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
24a  
24a  
19b, c  
15.5b, c  
90  
24a  
3.8b, c  
28a  
28a  
28b, c  
22b, c  
110  
28a  
4.3b, c  
35  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
ID  
Continuous Drain Current (TJ = 150 °C)  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source Drain Diode Current  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
20  
L = 0.1 mH  
EAS  
20  
61  
mJ  
W
T
T
T
C = 25 °C  
C = 70 °C  
A = 25 °C  
48  
100  
64  
5.2b, c  
3.3b, c  
31  
PD  
Maximum Power Dissipation  
4.6b, c  
3b, c  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Channel-1  
Typ. Max.  
Channel-2  
Typ. Max.  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Unit  
t 10 s  
22  
27  
19  
1
24  
°C/W  
RthJC  
Steady State  
2.1  
2.6  
1.25  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not  
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required  
to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 62 °C/W for channel-1 and 55 °C/W for channel-2.  
Document Number: 67344  
S11-1652-Rev. B, 15-Aug-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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