New Product
SiZ730DT
Vishay Siliconix
N-Channel 30 V (D-S) MOSFETs
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
VDS (V)
RDS(on) (Ω)
ID (A) Qg (Typ.)
Definition
16a
16a
TrenchFET® Power MOSFETs
100 % Rg Tested
100 % UIS Tested
0.0093 at VGS = 10 V
0.0130 at VGS = 4.5 V
0.0039 at VGS = 10 V
0.0053 at VGS = 4.5 V
•
•
•
Channel-1
Channel-2
30
7.7 nC
35a
35a
30
21.2 nC
• Compliant to RoHS Directive 2002/95/EC
V
/D
IN 1
APPLICATIONS
•
System Power
- Notebook
PowerPAIR® 6 x 3.7
- Server
POL
Synchronous Buck Converter
G
G
/
HS
G1
2
•
•
3.73 mm
D1
Pin 1
1
GHS
1
D1
3
1
VIN
N-Channel 1
MOSFET
2
VIN
VIN
V
SW
/
D1
3
S /D
1 2
S1/D2
G2
G
G
/
LS
VSW
GLS
GND
S2
2
6
6.00 mm
6
S2
5
GND
N-Channel 2
MOSFET
5
4
4
GND/S
Ordering Information: SiZ730DT-T1-GE3 (Lead (Pb)-free and Halogen-free)
2
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)
A
Parameter
Symbol
Channel-1
Channel-2
Unit
VDS
30
20
Drain-Source Voltage
Gate-Source Voltage
V
VGS
16a
16a
12.9b, c
10.3b, c
70
16a
3.2b, c
35a
35a
26.4b, c
21.1b, c
100
35a
3.8b, c
30
T
C = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
Continuous Drain Current (TJ = 150 °C)
A
IDM
IS
Pulsed Drain Current (t = 300 µs)
TC = 25 °C
TA = 25 °C
Continuous Source Drain Diode Current
IAS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
16
L = 0.1 mH
EAS
13
45
mJ
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
27
48
17
31
PD
Maximum Power Dissipation
W
3.9b, c
2.5b, c
4.6b, c
3b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Channel-1
Typ. Max.
Channel-2
Typ. Max.
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
Unit
t ≤ 10 s
Steady State
24
32
20
2
27
°C/W
RthJC
3.5
4.6
2.6
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 67 °C/W for channel-1 and 65 °C/W for channel-2.
Document Number: 67648
S11-0609-Rev. A, 04-Apr-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000