Si7946ADP
Vishay Siliconix
www.vishay.com
Dual N-Channel 150 V (D-S) MOSFET
FEATURES
• ThunderFET® technology optimizes balance
of RDS(on), Qg, Qsw and Qoss
PowerPAK® SO-8 Dual
D1
D1
7
8
D2
6
D2
5
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
1
S1
2
G1
3
1
4
G2
S2
APPLICATIONS
D
1
D
2
Top View
Bottom View
• DC/DC converters / boost
converters
PRODUCT SUMMARY
• Primary side switch
• Synchronous rectification
• Power management
• LED backlighting
VDS (V)
150
0.186
0.193
0.256
4.3
G
G
2
1
RDS(on) max. () at VGS = 10 V
RDS(on) max. () at VGS = 7.5 V
RDS(on) max. () at VGS = 6 V
Qg typ. (nC)
ID (A) a
Configuration
S
S
2
1
7.7
Dual
N-Channel
MOSFET
N-Channel
MOSFET
• Power-over-Ethernet
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
Si7946ADP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
150
20
UNIT
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
7.7
6.2
3.3 b, c
2.6 b, c
10
8 g
2.9 b, c
7
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
2.5
mJ
W
19.8
12.7
3.5 b, c
2.3 b, c
TC = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
25
MAXIMUM
UNIT
t 10 s
Steady state
35
6.3
°C/W
4.8
Notes
a. Based on TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 80 °C/W
g. Package limited
S14-1339-Rev. A, 30-Jun-14
Document Number: 62958
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000