Si7946ADP
Vishay Siliconix
www.vishay.com
Dual N-Channel 150 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
• ThunderFET® technology optimizes balance
of RDS(on), Qg, Qsw and Qoss
VDS (V)
RDS(on) (Ω) MAX.
0.186 at VGS = 10 V
0.193 at VGS = 7.5 V
0.256 at VGS = 6 V
ID (A) a
7.7
Qg (TYP.)
• 100 % Rg and UIS tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
150
7.6
4.3 nC
4
PowerPAK® SO-8 Dual
D1
APPLICATIONS
• DC/DC converters / boost
converters
D1
7
8
D
1
D
2
D2
6
D2
5
• Primary side switch
• Synchronous rectification
• Power management
• LED backlighting
G
G
2
1
1
S1
2
G1
3
S2
1
4
• Power-over-Ethernet
G2
Bottom View
Top View
S
1
S
2
Ordering Information:
Si7946ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel
MOSFET
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
150
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
A
VGS
20
T
C = 25 °C
C = 70 °C
7.7
T
6.2
Continuous Drain Current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
3.3 b, c
2.6 b, c
10
8 g
2.9 b, c
Pulsed Drain Current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous Source-Drain Diode Current
TA = 25 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
IAS
7
L = 0.1 mH
EAS
2.5
mJ
W
T
C = 25 °C
C = 70 °C
19.8
12.7
3.5 b, c
2.3 b, c
T
Maximum Power Dissipation
PD
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
TJ, Tstg
-55 to 150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient b, f
SYMBOL
RthJA
TYPICAL
25
MAXIMUM
UNIT
t ≤ 10 s
35
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
4.8
6.3
Notes
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
g. Package limited.
S14-1339-Rev. A, 30-Jun-14
Document Number: 62958
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000