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Si7972DP PDF预览

Si7972DP

更新时间: 2024-09-17 14:53:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 224K
描述
Dual N-Channel 60 V (D-S) MOSFET

Si7972DP 数据手册

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Si7972DP  
Vishay Siliconix  
www.vishay.com  
Dual N-Channel 60 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PowerPAK® SO-8 Dual  
D1  
D1  
7
8
• PWM optimized  
D2  
6
D2  
5
• 100 % Rg and UIS tested  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
2
G1  
S1  
APPLICATIONS  
3
S2  
1
4
• System power DC/DC  
G2  
D
1
D
2
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) max. (Ω) at VGS = 10 V  
60  
0.018  
0.021  
7.1  
8 a  
Dual  
G
G
2
1
R
DS(on) max. (Ω) at VGS = 4.5 V  
Qg typ. (nC)  
D (A)  
Configuration  
I
N-Channel MOSFET  
N-Channel MOSFET  
S
1
S
2
ORDERING INFORMATION  
Package  
PowerPAK SO-8  
Si7972DP-T1-GE3  
Lead (Pb)-free and halogen-free  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
60  
20  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
T
T
C = 25 °C  
C = 70 °C  
8 a  
8 a  
8 a  
8 a  
40  
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current  
IDM  
IS  
T
C = 25 °C  
19  
3 b, c  
Source-drain current diode current  
TA = 25 °C  
T
T
C = 25 °C  
C = 70 °C  
22  
14  
Maximum power dissipation  
PD  
W
TA = 25 °C  
TA = 70 °C  
3.6 b, c  
2.3 b, c  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
-55 to +150  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
SYMBOL  
RthJA  
TYP.  
MAX.  
35  
UNIT  
t 10 s  
Steady state  
26  
4
°C/W  
Maximum junction-to-case (drain)  
RthJC  
5.5  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 80 °C/W  
S21-0760-Rev. C, 12-Jul-2021  
Document Number: 75360  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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