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SI7998DP PDF预览

SI7998DP

更新时间: 2024-11-06 06:11:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
12页 144K
描述
Dual N-Channel 30-V (D-S) MOSFET

SI7998DP 数据手册

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New Product  
Si7998DP  
Vishay Siliconix  
Dual N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
ID (A)a  
25  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
TrenchFET® Power MOSFET  
PWM Optimized  
0.0093 at VGS = 10 V  
0.0124 at VGS = 4.5 V  
0.0053 at VGS = 10 V  
0.007 at VGS = 4.5 V  
Channel-1  
Channel-2  
30  
8.2  
25  
30  
APPLICATIONS  
30  
15.3  
30  
System Power DC/DC  
PowerPAK SO-8  
D
1
D
2
S1  
5.15 mm  
6.15 mm  
1
G1  
2
S2  
3
G2  
4
D1  
8
D1  
G
G
2
1
7
D2  
6
D2  
5
Bottom View  
Ordering Information: Si7998DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
S
2
1
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Channel-1  
Channel-2  
Unit  
VDS  
30  
20  
30  
20  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
25a  
25a  
15b, c  
12b, c  
60  
30a  
30a  
21b, c  
17b, c  
80  
30a  
3.3b, c  
40  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
19  
Source-Drain Current Diode Current  
3.0b, c  
22  
T
C = 25 °C  
C = 70 °C  
T
14  
25  
PD  
Maximum Power Dissipation  
W
3.6b, c  
2.3b, c  
4.0b, c  
2.5b, c  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Channel-1  
Typ. Max.  
26 35  
5.5  
Channel-2  
Typ. Max.  
22 31  
2.2 3.1  
Parameter  
Maximum Junction-to-Ambientb, f  
Symbol  
RthJA  
Unit  
t 10 s  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
Steady State  
4
Notes:  
a. Package Limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions for channel 1 and channel 2 is 80 °C/W.  
Document Number: 68970  
S09-0269-Rev. B, 16-Feb-09  
www.vishay.com  
1

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