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SI7983DP PDF预览

SI7983DP

更新时间: 2024-11-30 01:25:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
6页 96K
描述
Dual P-Channel 20-V (D-S) MOSFET

SI7983DP 数据手册

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Si7983DP  
Vishay Siliconix  
Dual P-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 12  
Available  
TrenchFET® Power MOSFET  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
0.017 at VGS = - 4.5 V  
0.020 at VGS = - 2.5 V  
0.024 at VGS = - 1.8 V  
- 20  
- 11  
- 10.1  
APPLICATIONS  
Load Switch  
PowerPAK SO-8  
S1  
5.15 mm  
6.15 mm  
S
1
S
2
1
G1  
2
S2  
3
G2  
4
D1  
G
G
2
1
8
D1  
7
D2  
6
D2  
5
Bottom View  
Ordering Information: Si7983DP-T1-E3 (Lead (Pb)-free)  
D
1
D
2
Si7983DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
- 20  
8
V
VGS  
TA = 25 °C  
TA = 70 °C  
- 12  
- 7.7  
- 6.2  
- 30  
Continuous Drain Current (TJ = 150 °C)a  
ID  
- 9.6  
A
IDM  
IS  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
- 2.9  
3.5  
- 1.2  
1.4  
TA = 25 °C  
TA = 70 °C  
Maximum Power Dissipationa  
PD  
W
2.2  
0.9  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
35  
85  
Maximum Junction-to-Ambienta  
RthJA  
60  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
2.2  
2.7  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72637  
S09-0272-Rev. B, 16-Feb-09  
www.vishay.com  
1

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