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SI7945DP-T1-E3 PDF预览

SI7945DP-T1-E3

更新时间: 2024-11-09 15:51:15
品牌 Logo 应用领域
威世 - VISHAY 开关晶体管
页数 文件大小 规格书
6页 128K
描述
Trans MOSFET P-CH 30V 7A 8-Pin PowerPAK SO T/R

SI7945DP-T1-E3 技术参数

是否无铅: 不含铅生命周期:Obsolete
零件包装代码:SOT包装说明:SMALL OUTLINE, R-XDSO-C6
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.81
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):7 A
最大漏极电流 (ID):7 A最大漏源导通电阻:0.02 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XDSO-C6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):3.5 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SI7945DP-T1-E3 数据手册

 浏览型号SI7945DP-T1-E3的Datasheet PDF文件第2页浏览型号SI7945DP-T1-E3的Datasheet PDF文件第3页浏览型号SI7945DP-T1-E3的Datasheet PDF文件第4页浏览型号SI7945DP-T1-E3的Datasheet PDF文件第5页浏览型号SI7945DP-T1-E3的Datasheet PDF文件第6页 
Si7945DP  
Vishay Siliconix  
Dual P-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 10.9  
- 8.8  
Qg (Typ.)  
Available  
0.020 at VGS = - 10 V  
0.031 at VGS = - 4.5 V  
TrenchFET® Power MOSFETs  
- 30  
49  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
APPLICATIONS  
Battery and Load Switching  
- Notebook PCs  
PowerPAK SO-8  
- Game Systems  
S1  
5.15 mm  
6.15 mm  
- Set-Top Box  
1
G1  
S
1
S
2
2
S2  
3
G2  
4
D1  
8
D1  
G
G
2
1
7
D2  
6
D2  
5
Bottom View  
Ordering Information: Si7945DP-T1-E3 (Lead (Pb)-free)  
D
1
D
2
Si7945DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
- 30  
V
20  
TA = 25 °C  
TA = 70 °C  
- 10.9  
- 8.7  
- 7.0  
- 5.6  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IS  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
- 30  
- 2.9  
3.5  
- 1.2  
1.4  
TA = 25 °C  
Maximum Power Dissipationa  
PD  
W
TA = 70 °C  
2.2  
0.9  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
35  
85  
Maximum Junction-to-Ambienta  
RthJA  
60  
°C/W  
Maximum Junction-to-Case (Drain)  
RthJC  
2.5  
3.1  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72090  
S09-0227-Rev. D, 09-Feb-09  
www.vishay.com  
1

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