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SI7894ADP-T1-GE3 PDF预览

SI7894ADP-T1-GE3

更新时间: 2024-11-28 14:35:47
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
6页 86K
描述
TRANSISTOR 17 A, 30 V, 0.0036 ohm, N-CHANNEL, Si, POWER, MOSFET, HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8, FET General Purpose Power

SI7894ADP-T1-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOT
包装说明:SMALL OUTLINE, R-XDSO-C5针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.76外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):17 A最大漏极电流 (ID):17 A
最大漏源导通电阻:0.0036 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XDSO-C5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):5.4 W最大脉冲漏极电流 (IDM):60 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:YES端子面层:MATTE TIN
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SI7894ADP-T1-GE3 数据手册

 浏览型号SI7894ADP-T1-GE3的Datasheet PDF文件第2页浏览型号SI7894ADP-T1-GE3的Datasheet PDF文件第3页浏览型号SI7894ADP-T1-GE3的Datasheet PDF文件第4页浏览型号SI7894ADP-T1-GE3的Datasheet PDF文件第5页浏览型号SI7894ADP-T1-GE3的Datasheet PDF文件第6页 
Si7894ADP  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
25  
Qg (Typ.)  
Available  
TrenchFET® Power MOSFET  
0.0036 at VGS = 10 V  
0.0045 at VGS = 4.5 V  
30  
58  
Optimized for “Low Side” Synchronous  
Rectifier Operation  
23  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
PowerPAK SO-8  
100 % Rg Tested  
APPLICATIONS  
S
6.15 mm  
5.15 mm  
DC/DC Converters  
1
S
2
Synchronous Rectifiers  
S
3
G
D
4
D
8
D
7
D
6
D
G
5
Bottom View  
S
N-Channel MOSFET  
Ordering Information:  
Si7894ADP-T1-E3 (Lead (Pb)-free)  
Si7894ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
30  
12  
V
VGS  
TA = 25 °C  
A = 70 °C  
25  
19  
17  
13  
Continuous Drain Current (TJ = 150 °C)a  
ID  
T
IDM  
IS  
A
Pulsed Drain Current (10 µs Pulse Width)  
60  
45  
Continuous Source Current (Diode Conduction)a  
Avalanche Current  
4.5  
1.6  
IAS  
L = 0.1 mH  
TA = 25 °C  
5.4  
3.4  
1.9  
1.2  
Maximum Power Dissipationa  
PD  
W
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
18  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
23  
65  
Maximum Junction-to-Ambienta  
RthJA  
50  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
1.0  
1.5  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73167  
S09-0222-Rev. B, 09-Feb-09  
www.vishay.com  
1

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