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SI7901EDN-T1-GE3 PDF预览

SI7901EDN-T1-GE3

更新时间: 2024-11-28 15:51:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
12页 565K
描述
Small Signal Field-Effect Transistor, P-Channel, Metal-oxide Semiconductor FET,

SI7901EDN-T1-GE3 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:,Reach Compliance Code:compliant
风险等级:5.76Is Samacsys:N
最大漏极电流 (Abs) (ID):4.3 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e3湿度敏感等级:1
最高工作温度:150 °C峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):2.8 W
子类别:Other Transistors表面贴装:YES
端子面层:PURE MATTE TIN处于峰值回流温度下的最长时间:30
Base Number Matches:1

SI7901EDN-T1-GE3 数据手册

 浏览型号SI7901EDN-T1-GE3的Datasheet PDF文件第2页浏览型号SI7901EDN-T1-GE3的Datasheet PDF文件第3页浏览型号SI7901EDN-T1-GE3的Datasheet PDF文件第4页浏览型号SI7901EDN-T1-GE3的Datasheet PDF文件第5页浏览型号SI7901EDN-T1-GE3的Datasheet PDF文件第6页浏览型号SI7901EDN-T1-GE3的Datasheet PDF文件第7页 
Si7901EDN  
Vishay Siliconix  
Dual P-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 6.3  
- 5.3  
- 4.6  
Available  
TrenchFET® Power MOSFETS: 1.8 V Rated  
ESD Protected: 4500 V  
Ultra Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
0.048 at VGS = - 4.5 V  
0.068 at VGS = - 2.5 V  
0.090 at VGS = - 1.8 V  
- 20  
APPLICATIONS  
Bidirectional Switch  
PowerPAK 1212-8  
S
1
S
2
S1  
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
D1  
8
D1  
7
G
G
1
2
D2  
6
3 kΩ  
3 kΩ  
D2  
5
Bottom View  
D
1
D
2
Ordering Information: Si7901EDN-T1-E3 (Lead (Pb)-free)  
Si7901EDN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Symbol  
10 s  
Steady State  
Unit  
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 20  
12  
V
VGS  
TA = 25 °C  
TA = 85 °C  
- 6.3  
- 4.5  
- 4.3  
- 3.1  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IS  
- 20  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
- 2.3  
2.8  
- 1.1  
1.3  
T
T
A = 25 °C  
A = 85 °C  
Maximum Power Dissipationa  
PD  
W
1.5  
0.7  
Operating Junction and Storage Temperature Range  
Soldering Recommendationsb,c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t 10 s  
35  
75  
4
44  
94  
5
Maximum Junction-to-Ambienta  
RthJA  
Steady State  
Steady State  
°C/W  
Maximum Junction-to-Case (Drain)  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
RthJC  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71430  
S-83043-Rev. C, 22-Dec-08  
www.vishay.com  
1

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