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SI7904DN-T1-GE3 PDF预览

SI7904DN-T1-GE3

更新时间: 2024-09-13 15:51:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
11页 535K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET, ROHS COMPLIANT, 1212-8, POWERPAK-8

SI7904DN-T1-GE3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, S-XDSO-C6针数:8
Reach Compliance Code:compliant风险等级:5.71
最大漏极电流 (Abs) (ID):5.3 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-XDSO-C6端子数量:6
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2.8 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SI7904DN-T1-GE3 数据手册

 浏览型号SI7904DN-T1-GE3的Datasheet PDF文件第2页浏览型号SI7904DN-T1-GE3的Datasheet PDF文件第3页浏览型号SI7904DN-T1-GE3的Datasheet PDF文件第4页浏览型号SI7904DN-T1-GE3的Datasheet PDF文件第5页浏览型号SI7904DN-T1-GE3的Datasheet PDF文件第6页浏览型号SI7904DN-T1-GE3的Datasheet PDF文件第7页 
Si7904DN  
Vishay Siliconix  
Dual N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free Option Available  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
7.7  
TrenchFET® Power MOSFETS: 1.8 V Rated  
0.030 at VGS = 4.5 V  
0.036 at VGS = 2.5 V  
0.045 at VGS = 1.8 V  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
RoHS  
COMPLIANT  
20  
7.0  
6.3  
APPLICATIONS  
HDD Spindle Drive  
PowerPAK 1212-8  
S1  
3.30 mm  
3.30 mm  
1
G1  
D
1
D
2
2
S2  
3
G2  
4
D1  
8
D1  
7
G
1
G
2
D2  
6
D2  
5
Bottom View  
S
1
S
2
Ordering Information: Si7904DN-T1-E3 (Lead (Pb)-free)  
Si7904DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
20  
V
VGS  
8
TA = 25 °C  
TA = 85 °C  
7.7  
5.5  
5.3  
3.8  
Continuous Drain Current (TJ = 150 °C)a  
ID  
IDM  
IS  
20  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
Single Pulse Avalanche Current  
Avalanche Energy  
2.3  
1.1  
IAS  
EAS  
15  
11  
L = 0.1 mH  
mJ  
W
TA = 25 °C  
2.8  
1.5  
1.3  
Maximum Power Dissipationa  
PD  
TA = 85 °C  
0.85  
Operating Junction and Storage Temperature Range  
Soldering Recommendationsb,c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t 10 s  
35  
75  
4
44  
94  
5
Maximum Junction-to-Ambienta  
RthJA  
RthJC  
Steady State  
Steady State  
°C/W  
Maximum Junction-to-Case  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71643  
S-81544-Rev. G, 07-Jul-08  
www.vishay.com  
1

SI7904DN-T1-GE3 替代型号

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SI7904DN-T1-E3 VISHAY

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