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SI7904BDN-T1-GE3 PDF预览

SI7904BDN-T1-GE3

更新时间: 2024-10-30 09:25:47
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 558K
描述
Dual N-Channel 20-V (D-S) MOSFET

SI7904BDN-T1-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, S-XDSO-C6
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:0.91
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):6 A
最大漏极电流 (ID):6 A最大漏源导通电阻:0.03 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-XDSO-C6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):17.8 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:MATTE TIN端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

SI7904BDN-T1-GE3 数据手册

 浏览型号SI7904BDN-T1-GE3的Datasheet PDF文件第2页浏览型号SI7904BDN-T1-GE3的Datasheet PDF文件第3页浏览型号SI7904BDN-T1-GE3的Datasheet PDF文件第4页浏览型号SI7904BDN-T1-GE3的Datasheet PDF文件第5页浏览型号SI7904BDN-T1-GE3的Datasheet PDF文件第6页浏览型号SI7904BDN-T1-GE3的Datasheet PDF文件第7页 
Si7904BDN  
Vishay Siliconix  
Dual N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
Available  
TrenchFET® Power MOSFET  
0.030 at VGS = 4.5 V  
0.036 at VGS = 2.5 V  
0.045 at VGS = 1.8 V  
6
6
6
20  
9 nC  
APPLICATIONS  
HDD Spindle Drive  
PowerPAK 1212-8  
S1  
3.30 mm  
3.30 mm  
D
1
D
2
1
G1  
2
S2  
3
G2  
4
D1  
8
D1  
G
1
G
2
7
D2  
6
D2  
5
Bottom View  
S
1
S
2
Ordering Information: Si7904BDN-T1-E3 (Lead (Pb)-free)  
Si7904BDN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
20  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
8
6a  
6a  
6a  
5.1b, c  
T
T
C = 25 °C  
C = 85 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 85 °C  
A
Pulsed Drain Current  
IDM  
IS  
20  
6a  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
2.1b, c  
17.8  
9.3  
2.5b, c  
1.3b, c  
TA = 25 °C  
TC = 25 °C  
T
C = 85 °C  
Maximum Power Dissipation  
PD  
W
TA = 25 °C  
TA = 85 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
40  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
t 10 s  
Steady State  
RthJA  
RthJC  
50  
7
°C/W  
Maximum Junction-to-Case (Drain)  
5.6  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 94 °C/W.  
Document Number: 74409  
S-83050-Rev. B, 29-Dec-08  
www.vishay.com  
1

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